It appears that the PS5 has quietly received a pretty big update. New units now shipping in some parts of the world feature an updated Oberon Plus SoC, based on TSMC's N6 process node. 

Since launch, Sony has redesigned the PS5 a couple of times, making the system lighter and reducing the size of the cooling heatsink inside the system. The latest CF1-1202 units also include a refreshed processor based on the TSMC N6 node, according to Angstronomics.

Image credit: Angstronomics

Comparing the N6 to the N7 node, we see an 18.8% increase in logic transistor density. That means that you can have a smaller N6 die with as many transistors as an N7. That's seen in the CFI-1202 die (left), which has a surface area of 260mm², whereas the older Oberon SoC (right) measures in at 300mm².

Moreover, the node transition also reduces power consumption at the same performance level. The reduced power requirements mean the die won't get as hot, which also allowed Sony to cut down on the size of the heatsink inside the system.

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KitGuru says: Despite all the advantages of the new PS5 model (lighter and reduced power consumption), the main objective of these changes was to reduce production costs. The smaller the die, the more you can take from a wafer. With this node transition, Sony may extract up to 20% more dies from a wafer while barely increasing costs, which should lead to more stock over the next year compared to 2020 and 2021. 

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