Tag Archives: SuperFin

Today Intel has revealed its roadmap of process and packaging improvements, which will power the next several generations of Intel CPUs leading up to 2025 and beyond. This includes Intel's first new transistor architecture in more than a decade.

With the release of Intel Tiger Lake coming soon, more details about the new architecture have surfaced. Intel's latest mobile chips use an intranode architecture restructure by implementing both SuperFin and SuperMIM technologies, offering a performance improvement equivalent to a “node leap”. The name SuperFin comes from the use of redesigned …