GlobalFoundries has revealed additional details regarding its 22nm fully-depleted silicon-on-insulator (FD-SOI) fabrication technology. The manufacturing process will be ready for tape-outs in early 2016 and will be used for mass production of chips by late next year. While the tech has a number of advantages, the process is designed primarily …
Read More »GlobalFoundries is evaluating 22nm FD SOI technology
Modern FinFET process technologies help to reduce power consumption of modern chips while increasing their clock-rate potential. Unfortunately, it is extremely expensive to design FinFET chips, which is why many chip developers cannot afford creation of new solutions. In a bid to help such companies to release new chips, GlobalFoundries …
Read More »GlobalFoundries: Customized and SOI process technologies gain importance
While non-standard fabrication processes are sometimes challenging and make it harder to re-use intellectual property across different product lineups, they are just what the doctor ordered when one needs to achieve certain goals. According to GlobalFoundries, the No. 2 contract maker of chips, many customized process technologies are gaining importance …
Read More »AMD readies new FX processor with bundled liquid-cooling
Advanced Micro Devices plans to release another FX-series desktop microprocessor that will come bundled with closed-loop liquid cooling system, the firm said this week. The company did not unveil any details about the upcoming chip, but demonstrated its packaging and said that it will be available soon. Roy Taylor, vice …
Read More »Samsung to boost performance of 28nm chips using FD-SOI
Samsung Electronics and STMicroelectronics this week inked a licensing agreement on 28nm fully depleted silicon-on-insulator (FD-SOI) technology. The deal grants Samsung rights to produce chips on FD-SOI wafers using a 28nm process technology developed by STMicroelectronics. The FD-SOI wafers will allow chip designers to get better performance or to cut-down …
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