Intel Corp. has implied a number of times that it did not need to use extreme ultraviolet lithography for its 7nm manufacturing process. However, after facing problems with multi-patterning methods at 14nm and 10nm fabrication technologies, it seems that the company has changed its mind. This week Intel said that …
Read More »Intel confirms delay of 10nm chips to 2017, blames difficulties
Intel Corp. on Wednesday confirmed the delay of mass production of central processing units using 10nm fabrication process to 2017. The company said that it ran into difficulties with its 10nm technology and decided to stretch the life-cycle of 14nm process with one more family of CPU products code-named “Kaby …
Read More »GlobalFoundries: We are producing 14nm chips for our customers, yields on-track
GlobalFoundries on Wednesday confirmed that it is had initiated high-volume production of chips for its customers using 14nm FinFET (14LPE) process technology. The company claims that yields of its 14nm semiconductors are comparable to yields at Samsung Foundry, the company that developed the 14LPE. “Our 14nm ramp is right on …
Read More »TSMC cuts prices of 20nm and 28nm chips by 10%
Taiwan Semiconductor Manufacturing Co. reduced prices of chip production using its 20nm and 28nm fabrication processes earlier this quarter, according to a media report. Customers of TSMC lowered orders for 20nm and 28nm chips and the company wants to increase utilization of its capacities by slashing prices. Potentially, the price-cuts …
Read More »TSMC rumoured to delay 10nm risk production, actual chips due in 2017
If the semiconductor market rumours are correct, then Intel Corp. might not be the only chipmaker, which plans to delay mass production of chips using 10nm manufacturing process. Apparently, Taiwan Semiconductor Manufacturing Co. postpones risk production using 10nm fabrication process by two quarters. “TSMC will start risk production in its …
Read More »Intel’s ‘Kaby Lake’ processors will be released in late 2016 – report
Intel Corp.’s “Kaby Lake” central processing units will be released exactly a year after the company’s “Skylake” chips due this August and September. The introduction of chips in late third quarter means that the company will further postpone the roll-out of microprocessors made using 10nm fabrication process. As reported, Intel’s …
Read More »TSMC builds first 10nm validation chip with quad-core Cortex-A57
Taiwan Semiconductor Manufacturing Co. has announced that it had produced the first verification chips for its 10nm manufacturing technology. The world’s largest contract maker of semiconductors plans to start risk production using 10nm fabrication process late this year and to initiate high-volume manufacturing in late 2016 or in 2017. At …
Read More »U.S. clears acquisition of IBM’s chip unit by GlobalFoundries
GlobalFoundries this week said that the U.S. authorities had approved its acquisition of IBM’s microelectronics business unit. From now on, GlobalFoundries will make various important semiconductors for the U.S. military and government agencies. The Committee on Foreign Investment in the United States (CFIUS) has reviewed the proposed transaction between IBM and …
Read More »More details about GlobalFoundries’ 22nm FD-SOI emerge
GlobalFoundries has revealed additional details regarding its 22nm fully-depleted silicon-on-insulator (FD-SOI) fabrication technology. The manufacturing process will be ready for tape-outs in early 2016 and will be used for mass production of chips by late next year. While the tech has a number of advantages, the process is designed primarily …
Read More »Intel delays ramp of 10nm mass production due to poor yields – report
Intel Corp. has again delayed installation of equipment necessary to produce semiconductors in high volume using 10nm process technology. It is believed that Intel experiences yield ramp issues, just like in case of its 14nm manufacturing tech, which is why it does not make sense for the company to buy …
Read More »UMC: 14nm FinFET technology will be ready for tape outs by year end
United Microelectronics Corp. said on Tuesday that it has successfully taped out a test chip from ARM using its 14nm FinFET fabrication technology. The company also revealed that the new manufacturing process will be ready for customer tape outs by the end of the year. UMC and ARM recently taped …
Read More »Nvidia and Samsung still cannot finalize chip manufacturing deal
Earlier this year Nvidia Corp. officially named Samsung Electronics its manufacturing partner. However, as it appears, the companies still have not signed any actual deals because negotiations are proceeding with difficulties. The consequence of prolonged negotiations could result in later-than-expected release of Samsung-made Nvidia chips. Nvidia wants Samsung Electronics to …
Read More »TSMC to begin building 10nm pilot line in June
Taiwan Semiconductor Manufacturing Co. has announced that it will start to install equipment needed to produce 10nm chips in one of its semiconductor fabrication facilities next month. The company hopes to start risk production of 10nm chips late this year. TSMC will start to construct its 10nm pilot line at …
Read More »Intel: We know how to produce 7nm chips
Intel Corp. will likely start making central processing units using 10nm fabrication process next year, but the company is already hard at work developing an even more advanced process technology. According to Intel, it already knows well how to produce chips at 7nm node. “After 10nm, comes 7nm [manufacturing technology] …
Read More »Intel: We will reveal schedule for 10nm chips later this year
Intel Corp. has been particularly tight-lipped about its roadmap concerning microprocessors to be made using 10nm fabrication process. However, on Friday the company said that development of the 10nm technology is progressing well and it will share more information about products it plans to produce using the process later this year. …
Read More »Nvidia: TSMC is our primary partner for 10nm and 16nm chips
Being one of the largest fabless designers of semiconductors in the world, Nvidia Corp. is a very special customer of Taiwan Semiconductor Manufacturing Co. For more than a decade, TSMC has been the primary producer of Nvidia graphics processing units and despite of Nvidia’s recent engagement with Samsung Foundry, TSMC …
Read More »GlobalFoundries is working on 10nm process technology internally
Just like other contract makers of semiconductors, GlobalFoundries is already developing its next-generation 10nm process technology. However, despite of the fact that GlobalFoundries is about to acquire IBM’s semiconductor manufacturing business and the company’s close ties to Samsung Electronics, the 10nm fabrication tech is developed completely internally at the moment. …
Read More »UMC skips 20nm planar process tech, leaps ahead to 16nm FinFET
United Microelectronics Corp., the world’s second largest contract maker of semiconductors, said that it would not offer 20nm planar fabrication process, but will jump directly to 16nm FinFET manufacturing technology. Skipping the node will help the company to catch up with its competitors. Although it was widely expected that UMC …
Read More »Samsung to invest additional $9.2 billion in its $14.4 billion fab
Samsung Electronics plans to invest additional $9.2 billion in capacity expansion of the world’s largest semiconductor fab, a media report claims. At present it is unclear how exactly Samsung plans to expand its fab, but the cost of the whole project – around $23.6 billion – already looks staggering. Samsung …
Read More »ASML sells 15 EUV lithography scanners, possibly, to Intel
ASML Holding NV, one of the world’s leading makers of semiconductor manufacturing equipment, this week said that it had signed an agreement with one of its major U.S.-based customers to deliver at least 15 ASML extreme ultraviolet (EUV) EUV lithography systems. Given the scale of the order it is highly likely …
Read More »TSMC: We will start risk production of 7nm chips in 2017
Taiwan Semiconductor Manufacturing Co. remains optimistic about its abilities to make chips using thinner process technologies going forward. Last week the company said that it would start risk production of integrated circuits using its 7nm process technology in 2017. Mass production of commercial 7nm products will likely begin in 2018, …
Read More »Intel: We are not discussing our 10nm schedules
Intel Corp. is confident that its 10nm manufacturing process will enable it to build central processing units cost-efficiently. However, the company does not want to reveal when exactly it plans to start making chips using its next-generation 10nm fabrication technology. In accordance with Moore’s law and Intel's tick-tock cadence, the company needs to …
Read More »Intel: 10nm and 7nm technologies have perfect economic feasibility
It is not a secret that transitions to newer chip manufacturing processes are getting more difficult from financial capital standpoint since not only research and development costs more than before, but also production equipment is getting more expensive. In a bid to keep their prices at current levels, semiconductor companies need …
Read More »TSMC: 16nm yields are approaching mature levels
Although Taiwan Semiconductor Manufacturing Co. has delayed mass production of chips using its 16nm fabrication processes, this did not happen only because of low yields. According to the company, 16nm yields at TSMC are approaching mature levels. This year TSMC will offer two 16nm process technologies for clients: 16nm FinFET …
Read More »Intel is quietly delaying 10nm production – report
Intel Corp. delayed mass production of 14nm chips by nearly a year because of insufficient yields. According to a media report, something similar may happen to its 10nm manufacturing technology. Intel is setting up a small pilot line for 10nm production in D1X development fab in Hillsboro, Oregon, reports SemiconductorEngineering. …
Read More »TSMC’s 10nm goals: higher density and performance at lower power
Taiwan Semiconductor Manufacturing Co. this week unveiled first details about its 10nm fabrication process at the TSMC Technology Symposium in the U.S. The official goals are slightly less ambitious than those discussed last year, but the general focus of TSMC’s 10nm manufacturing technology is clear: considerable increase of transistor density compared to …
Read More »Intel: Moore’s law will last for another 10 years
Intel Corp. predicts that Moore’s law will last for at least another decade and the number of transistors per chip will keep doubling every two years. While there are challenges ahead, Intel’s engineers are going to solve them. Later this month Moore’s law will hit 50 years, an unprecedented date for the …
Read More »Samsung to use world’s largest $15 billion fab to produce DRAM – report
Samsung Electronics overwhelmed the world of semiconductors when it announced plans to build a chip production plant that will cost almost $15 billion last October. At the time it was unclear for what the giant plans to use its fab in Pyeongtaek, a city south of Seoul. According to a …
Read More »TSMC looking at new materials, transistor structures for sub-10nm tech
Taiwan Semiconductor Manufacturing Co. this week confirmed that it has a team of engineers working on a manufacturing process that will succeed 10nm fabrication technology towards the end of the decade. While the company did not reveal details about its sub-10nm process, it said that it considers various options for …
Read More »Mubadala: GlobalFoundries begins to ramp up production of 14nm chips
Mubadala Development Co., the Abu Dhabi-based investment and development company, said this week that GlobalFoundries, which is owned by Mubadala, has already begun to ramp up production of chips using 14nm fabrication process. “GlobalFoundries announced a strategic collaboration with Samsung to deliver capacity at 14nm, one of the industry’s most …
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