GlobalFoundries on Friday confirmed that the first products to be made using the company’s advanced 14nm LPP [low-power plus] manufacturing technology had been taped out. The contract maker of chips did not reveal any details, but indicated that prototype chips had demonstrated “excellent” performance and yields. One of the customers, …
Read More »GlobalFoundries: 14nm yields are exceeding our plans
GlobalFoundries, which started to manufacture chips using 14nm low-power early (14LPE) manufacturing technology several months ago, said on Friday that its yields exceed its original expectations. One of the world’s largest contract makers of semiconductors does not reveal its actual 14nm volumes, but since the chips are made for customers, …
Read More »GlobalFoundries develops 7nm and 10nm technologies in-house
GlobalFoundries is working on its own 7nm and 10nm fabrication processes and it does not look like the company has plans to license technologies from the outside. The contract maker of semiconductors hopes that specialists from IBM’s microelectronics unit will help it to design world-class leading-edge manufacturing processes. GlobalFoundries, which …
Read More »Chinese investors eye GlobalFoundries to get new process technologies
China's National Integrated Circuit Industry Investment Fund has reportedly approached GlobalFoundries about possible acquisition or cooperation. Chinese investors intend to take over GlobalFoundries in order to significantly improve Semiconductor Manufacturing International Corporation (SMIC) and make it one of the world’s largest contract makers of semiconductors. China-based Hua Capital Management, which …
Read More »TSMC obtains orders from AMD and Nvidia for 16nm FinFET chips
Although Taiwan Semiconductor Manufacturing Co. is behind Samsung Foundry with its first-generation FinFET fabrication technology, which is why it lost orders from Apple and Qualcomm, it will still produce chips using 16nm FinFET manufacturing process for other major customers, including Advanced Micro Devices and Nvidia Corp. Advanced Micro Devices plans …
Read More »Intel: Our foundry business is well, we have new customers
Brian Krzanich, chief executive officer of Intel Corp., claims that despite of lack of any announcements concerning its contract semiconductor manufacturing business unit, the latter is growing and is still an important opportunity for the chip giant. Moreover, it has new customers that Intel just cannot name. Intel established its …
Read More »Samsung adds 10nm FinFET tech to roadmap, mass production in 2016
Samsung Foundry this week said that it had officially added its 10nm FinFET fabrication technology into its foundry roadmap. The company also clarified that it will start mass production of chips using its third-generation manufacturing process with FinFET transistors in late 2016, which means that the first 16nm commercial chips …
Read More »TSMC plans to use EUV lithography for 5nm process technology
For quite a while, Taiwan Semiconductor Manufacturing Co. has been talking about using extreme ultraviolet (EUV) lithography for its advanced 10nm process technology. However, since appropriate scanners are not ready and will not be for at least a couple of years, the company will be unable to take advantage of …
Read More »TSMC’s 7nm tech will use 10nm elements, production starts in 2018
Taiwan Semiconductor Manufacturing Co. this week disclosed some additional details about its 7nm fabrication process. TSMC reiterated plans to start qualifications of the technology in early 2017 and then initiate volume production in 2018. The 7nm process will use certain elements derived from the 10nm fabrication process, which will help …
Read More »TSMC: 10nm is on-track for volume production start in Q4 2016
Taiwan Semiconductor Manufacturing Co. this week denied any delays of risk or mass production of chips using its 10nm process technology. The company intends to start volume production of semiconductors at 10nm node late next year, which means that its clients will receive their first 10nm chips in the first quarter …
Read More »TSMC begins shipments of chips made using 16nm FinFET process tech
Taiwan Semiconductor Manufacturing Co. announced on Thursday that it had started volume production of chips using its 16nm FinFET manufacturing technology in the second quarter of 2015. The world’s largest contract maker of semiconductors is delivering the first batch of products made at 16nm node to its customers right now, …
Read More »Intel wants to use EUV lithography for 7nm process technology
Intel Corp. has implied a number of times that it did not need to use extreme ultraviolet lithography for its 7nm manufacturing process. However, after facing problems with multi-patterning methods at 14nm and 10nm fabrication technologies, it seems that the company has changed its mind. This week Intel said that …
Read More »Intel confirms delay of 10nm chips to 2017, blames difficulties
Intel Corp. on Wednesday confirmed the delay of mass production of central processing units using 10nm fabrication process to 2017. The company said that it ran into difficulties with its 10nm technology and decided to stretch the life-cycle of 14nm process with one more family of CPU products code-named “Kaby …
Read More »GlobalFoundries: We are producing 14nm chips for our customers, yields on-track
GlobalFoundries on Wednesday confirmed that it is had initiated high-volume production of chips for its customers using 14nm FinFET (14LPE) process technology. The company claims that yields of its 14nm semiconductors are comparable to yields at Samsung Foundry, the company that developed the 14LPE. “Our 14nm ramp is right on …
Read More »TSMC rumoured to delay 10nm risk production, actual chips due in 2017
If the semiconductor market rumours are correct, then Intel Corp. might not be the only chipmaker, which plans to delay mass production of chips using 10nm manufacturing process. Apparently, Taiwan Semiconductor Manufacturing Co. postpones risk production using 10nm fabrication process by two quarters. “TSMC will start risk production in its …
Read More »Intel’s ‘Kaby Lake’ processors will be released in late 2016 – report
Intel Corp.’s “Kaby Lake” central processing units will be released exactly a year after the company’s “Skylake” chips due this August and September. The introduction of chips in late third quarter means that the company will further postpone the roll-out of microprocessors made using 10nm fabrication process. As reported, Intel’s …
Read More »TSMC builds first 10nm validation chip with quad-core Cortex-A57
Taiwan Semiconductor Manufacturing Co. has announced that it had produced the first verification chips for its 10nm manufacturing technology. The world’s largest contract maker of semiconductors plans to start risk production using 10nm fabrication process late this year and to initiate high-volume manufacturing in late 2016 or in 2017. At …
Read More »U.S. clears acquisition of IBM’s chip unit by GlobalFoundries
GlobalFoundries this week said that the U.S. authorities had approved its acquisition of IBM’s microelectronics business unit. From now on, GlobalFoundries will make various important semiconductors for the U.S. military and government agencies. The Committee on Foreign Investment in the United States (CFIUS) has reviewed the proposed transaction between IBM and …
Read More »Intel delays ramp of 10nm mass production due to poor yields – report
Intel Corp. has again delayed installation of equipment necessary to produce semiconductors in high volume using 10nm process technology. It is believed that Intel experiences yield ramp issues, just like in case of its 14nm manufacturing tech, which is why it does not make sense for the company to buy …
Read More »TSMC to begin building 10nm pilot line in June
Taiwan Semiconductor Manufacturing Co. has announced that it will start to install equipment needed to produce 10nm chips in one of its semiconductor fabrication facilities next month. The company hopes to start risk production of 10nm chips late this year. TSMC will start to construct its 10nm pilot line at …
Read More »Intel: We will reveal schedule for 10nm chips later this year
Intel Corp. has been particularly tight-lipped about its roadmap concerning microprocessors to be made using 10nm fabrication process. However, on Friday the company said that development of the 10nm technology is progressing well and it will share more information about products it plans to produce using the process later this year. …
Read More »Nvidia: TSMC is our primary partner for 10nm and 16nm chips
Being one of the largest fabless designers of semiconductors in the world, Nvidia Corp. is a very special customer of Taiwan Semiconductor Manufacturing Co. For more than a decade, TSMC has been the primary producer of Nvidia graphics processing units and despite of Nvidia’s recent engagement with Samsung Foundry, TSMC …
Read More »GlobalFoundries is working on 10nm process technology internally
Just like other contract makers of semiconductors, GlobalFoundries is already developing its next-generation 10nm process technology. However, despite of the fact that GlobalFoundries is about to acquire IBM’s semiconductor manufacturing business and the company’s close ties to Samsung Electronics, the 10nm fabrication tech is developed completely internally at the moment. …
Read More »Samsung to invest additional $9.2 billion in its $14.4 billion fab
Samsung Electronics plans to invest additional $9.2 billion in capacity expansion of the world’s largest semiconductor fab, a media report claims. At present it is unclear how exactly Samsung plans to expand its fab, but the cost of the whole project – around $23.6 billion – already looks staggering. Samsung …
Read More »ASML sells 15 EUV lithography scanners, possibly, to Intel
ASML Holding NV, one of the world’s leading makers of semiconductor manufacturing equipment, this week said that it had signed an agreement with one of its major U.S.-based customers to deliver at least 15 ASML extreme ultraviolet (EUV) EUV lithography systems. Given the scale of the order it is highly likely …
Read More »Intel: 10nm and 7nm technologies have perfect economic feasibility
It is not a secret that transitions to newer chip manufacturing processes are getting more difficult from financial capital standpoint since not only research and development costs more than before, but also production equipment is getting more expensive. In a bid to keep their prices at current levels, semiconductor companies need …
Read More »TSMC: 16nm yields are approaching mature levels
Although Taiwan Semiconductor Manufacturing Co. has delayed mass production of chips using its 16nm fabrication processes, this did not happen only because of low yields. According to the company, 16nm yields at TSMC are approaching mature levels. This year TSMC will offer two 16nm process technologies for clients: 16nm FinFET …
Read More »Intel is quietly delaying 10nm production – report
Intel Corp. delayed mass production of 14nm chips by nearly a year because of insufficient yields. According to a media report, something similar may happen to its 10nm manufacturing technology. Intel is setting up a small pilot line for 10nm production in D1X development fab in Hillsboro, Oregon, reports SemiconductorEngineering. …
Read More »TSMC’s 10nm goals: higher density and performance at lower power
Taiwan Semiconductor Manufacturing Co. this week unveiled first details about its 10nm fabrication process at the TSMC Technology Symposium in the U.S. The official goals are slightly less ambitious than those discussed last year, but the general focus of TSMC’s 10nm manufacturing technology is clear: considerable increase of transistor density compared to …
Read More »TSMC looking at new materials, transistor structures for sub-10nm tech
Taiwan Semiconductor Manufacturing Co. this week confirmed that it has a team of engineers working on a manufacturing process that will succeed 10nm fabrication technology towards the end of the decade. While the company did not reveal details about its sub-10nm process, it said that it considers various options for …
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