Tag Archives: fab

Last year, Intel announced plans to build new facilities in Europe to boost chip production. Now, that plan has been finalised, with Intel today announcing plans to invest as much as 80 billion euros in the EU over the next decade, as well as plans to create six new facilities …

Over the last year, Intel has begun planning new fab facilities in Europe, with financial support from the European Union. Since the EU is involved in the funding, the UK's exit from the European Union means that Intel did indeed strike the country off of its list for potential facility …

Foxconn has reportedly begun construction on a new advanced semiconductor assembly and test plant this week. Located in Qingdao, northeast China, this facility is expected to be used to manufacture “solutions for 5G and AI related” devices.  When looking into investments made in the semiconductor sector, it's easy to stumble across hefty sums …

Samsung has begun preparing itself for the incoming wave of demand for 10nm chips. Today, the company announced that its Foundries have commenced mass production of system-on-chip (SoC) products built using Samsung's second generation 10nm FinFET process, known as 10LPP (Low Power Plus). The new 10LPP process allows up to …

GlobalFoundries on Friday confirmed that the first products to be made using the company’s advanced 14nm LPP [low-power plus] manufacturing technology had been taped out. The contract maker of chips did not reveal any details, but indicated that prototype chips had demonstrated “excellent” performance and yields. One of the customers, …

GlobalFoundries, which started to manufacture chips using 14nm low-power early (14LPE) manufacturing technology several months ago, said on Friday that its yields exceed its original expectations. One of the world’s largest contract makers of semiconductors does not reveal its actual 14nm volumes, but since the chips are made for customers, …

GlobalFoundries is working on its own 7nm and 10nm fabrication processes and it does not look like the company has plans to license technologies from the outside. The contract maker of semiconductors hopes that specialists from IBM’s microelectronics unit will help it to design world-class leading-edge manufacturing processes. GlobalFoundries, which …

China's National Integrated Circuit Industry Investment Fund has reportedly approached GlobalFoundries about possible acquisition or cooperation. Chinese investors intend to take over GlobalFoundries in order to significantly improve Semiconductor Manufacturing International Corporation (SMIC) and make it one of the world’s largest contract makers of semiconductors. China-based Hua Capital Management, which …

SK Hynix, one of the leading manufacturers of NAND flash and the second largest maker of dynamic random access memory (DRAM), plans to spend 31 trillion won ($25.94 billion) to build two semiconductor production facilities in South Korea over the next 10 years. The expansion of production capacities will unlikely …

Samsung Foundry this week said that it had officially added its 10nm FinFET fabrication technology into its foundry roadmap. The company also clarified that it will start mass production of chips using its third-generation manufacturing process with FinFET transistors in late 2016, which means that the first 16nm commercial chips …

For quite a while, Taiwan Semiconductor Manufacturing Co. has been talking about using extreme ultraviolet (EUV) lithography for its advanced 10nm process technology. However, since appropriate scanners are not ready and will not be for at least a couple of years, the company will be unable to take advantage of …

Taiwan Semiconductor Manufacturing Co. this week disclosed some additional details about its 7nm fabrication process. TSMC reiterated plans to start qualifications of the technology in early 2017 and then initiate volume production in 2018. The 7nm process will use certain elements derived from the 10nm fabrication process, which will help …

Taiwan Semiconductor Manufacturing Co. this week denied any delays of risk or mass production of chips using its 10nm process technology. The company intends to start volume production of semiconductors at 10nm node late next year, which means that its clients will receive their first 10nm chips in the first quarter …

Intel Corp. has implied a number of times that it did not need to use extreme ultraviolet lithography for its 7nm manufacturing process. However, after facing problems with multi-patterning methods at 14nm and 10nm fabrication technologies, it seems that the company has changed its mind. This week Intel said that …

GlobalFoundries on Wednesday confirmed that it is had initiated high-volume production of chips for its customers using 14nm FinFET (14LPE) process technology. The company claims that yields of its 14nm semiconductors are comparable to yields at Samsung Foundry, the company that developed the 14LPE. “Our 14nm ramp is right on …

If the semiconductor market rumours are correct, then Intel Corp. might not be the only chipmaker, which plans to delay mass production of chips using 10nm manufacturing process. Apparently, Taiwan Semiconductor Manufacturing Co. postpones risk production using 10nm fabrication process by two quarters. “TSMC will start risk production in its …

Intel Corp.’s “Kaby Lake” central processing units will be released exactly a year after the company’s “Skylake” chips due this August and September. The introduction of chips in late third quarter means that the company will further postpone the roll-out of microprocessors made using 10nm fabrication process. As reported, Intel’s …

Taiwan Semiconductor Manufacturing Co. has announced that it had produced the first verification chips for its 10nm manufacturing technology. The world’s largest contract maker of semiconductors plans to start risk production using 10nm fabrication process late this year and to initiate high-volume manufacturing in late 2016 or in 2017. At …

GlobalFoundries this week said that the U.S. authorities had approved its acquisition of IBM’s microelectronics business unit. From now on, GlobalFoundries will make various important semiconductors for the U.S. military and government agencies. The Committee on Foreign Investment in the United States (CFIUS) has reviewed the proposed transaction between IBM and …

Intel Corp. has again delayed installation of equipment necessary to produce semiconductors in high volume using 10nm process technology. It is believed that Intel experiences yield ramp issues, just like in case of its 14nm manufacturing tech, which is why it does not make sense for the company to buy …

Taiwan Semiconductor Manufacturing Co. has announced that it will start to install equipment needed to produce 10nm chips in one of its semiconductor fabrication facilities next month. The company hopes to start risk production of 10nm chips late this year. TSMC will start to construct its 10nm pilot line at …

Intel Corp. has been particularly tight-lipped about its roadmap concerning microprocessors to be made using 10nm fabrication process. However, on Friday the company said that development of the 10nm technology is progressing well and it will share more information about products it plans to produce using the process later this year. …

Just like other contract makers of semiconductors, GlobalFoundries is already developing its next-generation 10nm process technology. However, despite of the fact that GlobalFoundries is about to acquire IBM’s semiconductor manufacturing business and the company’s close ties to Samsung Electronics, the 10nm fabrication tech is developed completely internally at the moment. …

Samsung Electronics plans to invest additional $9.2 billion in capacity expansion of the world’s largest semiconductor fab, a media report claims. At present it is unclear how exactly Samsung plans to expand its fab, but the cost of the whole project – around $23.6 billion – already looks staggering. Samsung …

ASML Holding NV, one of the world’s leading makers of semiconductor manufacturing equipment, this week said that it had signed an agreement with one of its major U.S.-based customers to deliver at least 15 ASML extreme ultraviolet (EUV) EUV lithography systems. Given the scale of the order it is highly likely …

It is not a secret that transitions to newer chip manufacturing processes are getting more difficult from financial capital standpoint since not only research and development costs more than before, but also production equipment is getting more expensive. In a bid to keep their prices at current levels, semiconductor companies need …

Intel Corp. delayed mass production of 14nm chips by nearly a year because of insufficient yields. According to a media report, something similar may happen to its 10nm manufacturing technology. Intel is setting up a small pilot line for 10nm production in D1X development fab in Hillsboro, Oregon, reports SemiconductorEngineering. …

Taiwan Semiconductor Manufacturing Co. this week unveiled first details about its 10nm fabrication process at the TSMC Technology Symposium in the U.S. The official goals are slightly less ambitious than those discussed last year, but the general focus of TSMC’s 10nm manufacturing technology is clear: considerable increase of transistor density compared to …

Samsung Electronics overwhelmed the world of semiconductors when it announced plans to build a chip production plant that will cost almost $15 billion last October. At the time it was unclear for what the giant plans to use its fab in Pyeongtaek, a city south of Seoul. According to a …

Taiwan Semiconductor Manufacturing Co. this week confirmed that it has a team of engineers working on a manufacturing process that will succeed 10nm fabrication technology towards the end of the decade. While the company did not reveal details about its sub-10nm process, it said that it considers various options for …