Financial analysts believe that the rumoured takeover of Micron Technology by China-based Tsinghua Unigroup could lead to a major change of Micron’s policies in regards of expansion of production capacities. If Tsinghua acquires Micron and starts to build new fabs to gain market share, this could result in oversupply of …
Read More »Chinese group could acquire Micron to boost local memory industry
Tsinghua Unigroup, a China-based investment company that controls Spreadtrum Communications and RDA Microelectronics, reportedly wants to acquire Micron Technology, the world’s third largest maker of DRAM and the No. 4 maker of NAND flash. China may need Micron in a bid to boost its homegrown memory industry and secure supply …
Read More »AMD reportedly has priority supply agreement regarding HBM, HBM2
The first-generation high-bandwidth memory provides extreme performance, but is clearly not perfect for high-end graphics cards due to capacity limitations. A good news is that second-gen high-bandwidth memory is on the way and is due in 2016. Advanced Micro Devices may get it faster and in higher volumes than its …
Read More »DRAM prices continue to drop despite of looming back-to-school season
Despite of the fact that personal computer makers are now buying dynamic random access memory in a bid to support demand during the back-to-school season, DRAM prices continue to drop. Not only weak demand impacts DRAM prices negatively. All memory makers are transiting to thinner manufacturing technologies and Samsung even …
Read More »Kingston remains world’s No. 1 memory module supplier
The year 2014 was very favourable for producers of dynamic random access memory as well as for makers of various DRAM modules thanks to rather high prices and stable demand for personal computers and other devices. Kingston Technology remained the top producer of memory modules on the planet with nearly …
Read More »Micron: We will close technological gap with Samsung with 16nm DRAM
Micron Technology, the world’s third largest maker of computer memory, plans to close its process technology gap with market leader Samsung Electronics with its next-generation fabrication technology in the coming years. The firm hopes that its new manufacturing process will help it to lower costs and increase performance of its …
Read More »Samsung drops prices of DDR4 memory to gain market share
DDR4 memory is yet to become mainstream DRAM technology, but Samsung Electronics is reportedly reducing prices of its DDR4 chips in a bid to gain market share. Samsung’s actions may trigger further drops of memory pricing in the future. At present DDR4 memory is used only by high-end desktop as …
Read More »Samsung putting pressure on DRAM prices – analyst
Some market observers believe that prices of dynamic random access memory are about to increase, which will significantly improve profitability of DRAM producers. While this is essentially correct, there are reports that Samsung Electronics is dropping prices of memory in a bid to boost revenues, which could hurt other manufacturers' …
Read More »Patriot Memory is reinventing itself to offer more than memory
When Patriot Memory was founded in 1985 – some 30 years ago – its main goal was to provide high-performance random access memory solutions for PCs. When I first met with Patriot Memory reps in person about a decade ago, the company was all about offering advanced memory modules, but …
Read More »JEDEC finalizes standard for ‘hybrid’ DDR4 NAND memory modules
JEDEC, a leading stanard setting organization, this week announced the first standards for support of “hybrid” memory modules that fit into DDR4 DRAM memory slots, but contain NAND flash memory. Such non-volatile dual in-line memory modules (NVDIMMs) will be used for ultra-high-performance storage devices as well as for ultra-secure DRAM …
Read More »DRAM prices hit new lows in May – report
Prices of dynamic random access memory have been declining rather rapidly this year because of weak demand for personal computers and tablets. According to a media report, DRAM prices are the lowest in about 26 months. DRAM sport prices dropped around 9 per cent in the second quarter of 2015, …
Read More »Intel bids adieu to DDR3: Majority of ‘Skylake-S’ mainboards to use DDR4
Intel Corp.’s upcoming code-named “Skylake-S” microprocessor will promote the new DDR4 memory standard considerably more aggressively than it was initially believed. Although integrated memory controller of “Skylake” supports different types of DRAM, the processors will not officially support DDR3, but will only be compatible with a low-power version of the …
Read More »G.Skill’s ‘world’s fastest’ 16GB DDR4 memory kit hits 3.66GHz
G.Skill, one of the leading makers of advanced memory modules, on Tuesday rolled-out its highest-performing DDR4 memory kit. The 16GB quad-channel set of memory modules can operate at whopping 3.66GHz and deliver incredible levels of performance in games and demanding applications. G.Skill’s Ripjaws 4 series DDR4 3666MHz memory kit consists of …
Read More »Samsung to invest additional $9.2 billion in its $14.4 billion fab
Samsung Electronics plans to invest additional $9.2 billion in capacity expansion of the world’s largest semiconductor fab, a media report claims. At present it is unclear how exactly Samsung plans to expand its fab, but the cost of the whole project – around $23.6 billion – already looks staggering. Samsung …
Read More »G.Skill debuts ‘world’s fastest’ 128GB 2.80GHz DDR4 memory kit
When it comes to high-end memory modules for enthusiasts, there is always a trade-off between their clock-rates and capacities. It is not easy to overclock DIMMs powered by multiple memory ICs [integrated circuits], which is why it is complicated to install a lot of fast memory. However, G.Skill on Thursday …
Read More »Samsung to use world’s largest $15 billion fab to produce DRAM – report
Samsung Electronics overwhelmed the world of semiconductors when it announced plans to build a chip production plant that will cost almost $15 billion last October. At the time it was unclear for what the giant plans to use its fab in Pyeongtaek, a city south of Seoul. According to a …
Read More »Micron begins trial production of DRAM using 10nm-class process tech
Micron Technology said this week that it had already begun trial production of dynamic random access memory (DRAM) chips using its 10nm-class fabrication process. The manufacturing technology is still under development, but trial production indicates that it is proceeding as planned. “1x nanometer DRAM development is also proceeding well and …
Read More »SK Hynix to start production of DRAM using 20nm process tech in 2H 2015
SK Hynix, the world’s second largest producer of dynamic random access memory, said this week that it would begin to mass-produce DRAM using 20nm fabrication process in the second half of the year. The new manufacturing technology will help the company to better address the needs of the high-end memory …
Read More »SK Hynix demos HBM2 memory ICs, opens way for 32GB graphics cards
SK Hynix has demonstrated a wafer with second-generation high-bandwidth memory (HBM) at the CeBIT trade-show in Hannover, Germany. The new memory chips will emerge on the market sometimes next year and will increase memory bandwidth and memory capacities for graphics cards and other applications. The first-generation HBM (HBM1) stacks four …
Read More »Nvidia ‘Pascal’ GPUs to offer up to 10X higher speed than ‘Maxwell’
At its GPU Technology Conference Nvidia Corp. revealed some details about its next-generation code-named “Pascal” architecture of graphics processing units. As expected, the new GPUs will feature numerous innovations that will provide significant benefits in performance in various types of applications. Nvidia noted three key technologies that the “Pascal” GPUs will have: …
Read More »AMD to introduce its Radeon R9 300-series lineup at Computex
Sources with knowledge of Advanced Micro Devices’ roadmap have revealed that the company plans to introduce its new family of Radeon R9 300-series graphics cards closer to Computex than CeBIT, as originally planned. AMD had hoped to push out one or two new cards in March and then re-brand many …
Read More »DRAM will remain in short supply this year – analyst
Even though Samsung Electronics plans to increase its manufacturing capacities for dynamic random access memory later this year, analysts believe that this will not create an oversupply on the DRAM market. The reasons for that are transitions to bigger memory dies as well as growing demand for higher memory capacities …
Read More »Samsung to supply half of Apple’s DRAM chips for iPhone 6 followup
Samsung and Apple have a strange relationship, they are constantly butting heads over patents in the court room, they are rivals in the mobile market and yet, Apple always ends up leaning on Samsung for its manufacturing needs. According to a new report, Samsung will be Apple's key iPhone supplier. …
Read More »50% of Samsung’s DRAM will be made using 20nm process in 2015 – report
Samsung Electronics will lead the market of dynamic random access memory with transition to 20nm fabrication process, a media report citing sources with knowledge of the matter claims. Over half of the company’s DRAM this year will be made using 20nm manufacturing technology. Demand for higher-performance and higher-density computer memory …
Read More »SK Hynix to speed up its DDR4 memory chips this year
SK Hynix plans to introduce new versions of its DDR4 dynamic random access memory chips capable of operating at higher clock-rates compared to those available today. The new chips will boost performance of high-end and performance-mainstream PCs in the second half of this year. Nowadays SK Hynix, Samsung Electronics and …
Read More »SK Hynix: LPDDR4 memory hits mass production
SK Hynix has announced that its 8Gb LPDDDR4 memory, which is in mass production now, has been chosen by a major smartphone maker for a new flagship model. The forthcoming handset will be among the first phones to use the new type of memory. SK Hynix’s 8Gb LPDDR4 memory chips …
Read More »Details about AMD Radeon R9 300-series product line emerge
As reported, Advanced Micro Devices plans to introduce its new Radeon R9 and Radeon R7 300-series products in the second quarter of the year. While the new product line will carry new model numbers, it will include graphics processing units that will not be exactly new. The Radeon R9 300-series …
Read More »AMD: We are putting the finishing touches on the Radeon R9 300-series
A representative of Advanced Micro Devices has confirmed that the development of its forthcoming product family based on a new breed of graphics processing units is on the finish line. While the novelties will not hit the market shortly, they will likely enter production in the coming weeks. “We are still …
Read More »Toshiba and SK Hynix to jointly develop nanoimprint lithography
Toshiba Corp. and SK Hynix on Thursday signed a formal agreement under which the two companies will jointly develop a nanoimprint lithography (NIL) process technology. The two producers of chips and computer memory plan to start using NIL technology in 2017. The companies believe that the tech will allow them …
Read More »Samsung integrates LPDDR3 and NAND flash into one chip
Samsung Electronics on Wednesday introduced the industry’s first memory solution that integrates dynamic random access memory (DRAM) and NAND flash into one package. The new package will help Samsung and its customers to make smartphones thinner and more cost efficient. The new ePoP (embedded package on package) memory package consists …
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