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Intel and Micron have formed a fruitful partnership, with the pair announcing the production and shipment of the industry's first 4bits/cell 3D NAND technology this week. These new NAND chips use the proven 64-layer structure, and have achieved 1 terabit (Tb) density per die, making it the highest density flash …
Read More »Micron and Intel join forces to produce the industry’s first QLC 3D NAND with 1Tb density
