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Samsung Electronics on Tuesday said that has started to produce 64GB DDR4 memory modules that are powered by DDR4 memory chips that feature three dimensional (3D) “through silicon via” (TSV) package technology. The DRAM [dynamic random access memory] modules are designed for enterprise servers. Samsung’s 64GB registered dual inline memory …
Read More »Samsung begins to produce 64GB DDR4 modules based on TSV chips
