Apacer on Tuesday unveiled a lineup of new DDR4 SO-DIMM memory kits for high-performance laptops. The new kits have up to 64GB capacity and can operate at clock-rates of up to 3000MHz. The new modules are designed for Intel’s new mobile “Skylake” central processing units and high-end gaming and workstation …
Read More »Samsung begins to produce 64GB DDR4 modules based on TSV chips
Samsung Electronics on Tuesday said that has started to produce 64GB DDR4 memory modules that are powered by DDR4 memory chips that feature three dimensional (3D) “through silicon via” (TSV) package technology. The DRAM [dynamic random access memory] modules are designed for enterprise servers. Samsung’s 64GB registered dual inline memory …
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