While Samsung and Qualcomm may have had their differences back when the Snapdragon 820 launched, it seems the two companies have since patched things up and going forward, they will be collaborating with Samsung set to manufacture Qualcomm's Snapdragon 835 chip based on the 10 nanometer process. Samsung's chip manufacturing …
Read More »Samsung adds 10nm FinFET tech to roadmap, mass production in 2016
Samsung Foundry this week said that it had officially added its 10nm FinFET fabrication technology into its foundry roadmap. The company also clarified that it will start mass production of chips using its third-generation manufacturing process with FinFET transistors in late 2016, which means that the first 16nm commercial chips …
Read More »TSMC’s 7nm tech will use 10nm elements, production starts in 2018
Taiwan Semiconductor Manufacturing Co. this week disclosed some additional details about its 7nm fabrication process. TSMC reiterated plans to start qualifications of the technology in early 2017 and then initiate volume production in 2018. The 7nm process will use certain elements derived from the 10nm fabrication process, which will help …
Read More »TSMC: 10nm is on-track for volume production start in Q4 2016
Taiwan Semiconductor Manufacturing Co. this week denied any delays of risk or mass production of chips using its 10nm process technology. The company intends to start volume production of semiconductors at 10nm node late next year, which means that its clients will receive their first 10nm chips in the first quarter …
Read More »Intel wants to use EUV lithography for 7nm process technology
Intel Corp. has implied a number of times that it did not need to use extreme ultraviolet lithography for its 7nm manufacturing process. However, after facing problems with multi-patterning methods at 14nm and 10nm fabrication technologies, it seems that the company has changed its mind. This week Intel said that …
Read More »Intel confirms delay of 10nm chips to 2017, blames difficulties
Intel Corp. on Wednesday confirmed the delay of mass production of central processing units using 10nm fabrication process to 2017. The company said that it ran into difficulties with its 10nm technology and decided to stretch the life-cycle of 14nm process with one more family of CPU products code-named “Kaby …
Read More »TSMC rumoured to delay 10nm risk production, actual chips due in 2017
If the semiconductor market rumours are correct, then Intel Corp. might not be the only chipmaker, which plans to delay mass production of chips using 10nm manufacturing process. Apparently, Taiwan Semiconductor Manufacturing Co. postpones risk production using 10nm fabrication process by two quarters. “TSMC will start risk production in its …
Read More »Intel’s ‘Kaby Lake’ processors will be released in late 2016 – report
Intel Corp.’s “Kaby Lake” central processing units will be released exactly a year after the company’s “Skylake” chips due this August and September. The introduction of chips in late third quarter means that the company will further postpone the roll-out of microprocessors made using 10nm fabrication process. As reported, Intel’s …
Read More »TSMC builds first 10nm validation chip with quad-core Cortex-A57
Taiwan Semiconductor Manufacturing Co. has announced that it had produced the first verification chips for its 10nm manufacturing technology. The world’s largest contract maker of semiconductors plans to start risk production using 10nm fabrication process late this year and to initiate high-volume manufacturing in late 2016 or in 2017. At …
Read More »Intel delays ramp of 10nm mass production due to poor yields – report
Intel Corp. has again delayed installation of equipment necessary to produce semiconductors in high volume using 10nm process technology. It is believed that Intel experiences yield ramp issues, just like in case of its 14nm manufacturing tech, which is why it does not make sense for the company to buy …
Read More »TSMC to begin building 10nm pilot line in June
Taiwan Semiconductor Manufacturing Co. has announced that it will start to install equipment needed to produce 10nm chips in one of its semiconductor fabrication facilities next month. The company hopes to start risk production of 10nm chips late this year. TSMC will start to construct its 10nm pilot line at …
Read More »Intel: We will reveal schedule for 10nm chips later this year
Intel Corp. has been particularly tight-lipped about its roadmap concerning microprocessors to be made using 10nm fabrication process. However, on Friday the company said that development of the 10nm technology is progressing well and it will share more information about products it plans to produce using the process later this year. …
Read More »Nvidia: TSMC is our primary partner for 10nm and 16nm chips
Being one of the largest fabless designers of semiconductors in the world, Nvidia Corp. is a very special customer of Taiwan Semiconductor Manufacturing Co. For more than a decade, TSMC has been the primary producer of Nvidia graphics processing units and despite of Nvidia’s recent engagement with Samsung Foundry, TSMC …
Read More »GlobalFoundries is working on 10nm process technology internally
Just like other contract makers of semiconductors, GlobalFoundries is already developing its next-generation 10nm process technology. However, despite of the fact that GlobalFoundries is about to acquire IBM’s semiconductor manufacturing business and the company’s close ties to Samsung Electronics, the 10nm fabrication tech is developed completely internally at the moment. …
Read More »Intel: 10nm and 7nm technologies have perfect economic feasibility
It is not a secret that transitions to newer chip manufacturing processes are getting more difficult from financial capital standpoint since not only research and development costs more than before, but also production equipment is getting more expensive. In a bid to keep their prices at current levels, semiconductor companies need …
Read More »TSMC’s 10nm goals: higher density and performance at lower power
Taiwan Semiconductor Manufacturing Co. this week unveiled first details about its 10nm fabrication process at the TSMC Technology Symposium in the U.S. The official goals are slightly less ambitious than those discussed last year, but the general focus of TSMC’s 10nm manufacturing technology is clear: considerable increase of transistor density compared to …
Read More »TSMC looking at new materials, transistor structures for sub-10nm tech
Taiwan Semiconductor Manufacturing Co. this week confirmed that it has a team of engineers working on a manufacturing process that will succeed 10nm fabrication technology towards the end of the decade. While the company did not reveal details about its sub-10nm process, it said that it considers various options for …
Read More »TSMC: We will close the gap with Intel at 10nm!
Taiwan Semiconductor Manufacturing Co. believes that its 10nm fabrication process will not only be available around the same time when Intel Corp. starts to use its 10nm technology, but will also offer similar performance and density as Intel’s. In a bid to speed up time-to-market of their manufacturing processes featuring FinFET …
Read More »Samsung: 10nm technology in development, 7nm will require new transistors
Kinam Kim, the president of Samsung Electronics’ semiconductor business, presented his view on the development of chip manufacturing technologies at the International Solid-State Circuits Conference 2015 this week. Samsung is already developing its next-generation 10nm FinFET fabrication process, but in order to continue scaling down structures of chips, new materials …
Read More »Intel vows to ship 10nm chips in early 2017, retracts its promise
While Intel Corp. has confirmed development of 10nm fabrication process as well as appropriate microprocessors, the company has never revealed exactly when it plans to introduce chips that will succeed its next-generation code-named “Skylake” CPUs. A couple of weeks ago a representative for Intel finally said that its first 10nm …
Read More »TSMC to start volume production of 10nm chips in 2017
Taiwan Semiconductor Manufacturing Co. has delayed volume production of chips using 16nm FinFET manufacturing technologies by several quarters. As a result, it now has to reconsider plans regarding production of semiconductors using 10nm FinFET fabrication process. Previously it was expected that the company will produce 10nm chips in late 2016, …
Read More »AMD downplays 20nm process tech: only ‘certain’ products will use it
Advanced Micro Devices on Wednesday implied that Taiwan Semiconductor Manufacturing Co.’s 20nm fabrication process would only be used for select products, whereas the main focus of the chip designer is on more advanced fabrication processes with FinFET transistors. Unfortunately, AMD did not reveal any actual plans. “From an overall standpoint, today …
Read More »ASML readies equipment to produce 5nm chips
We do not know exactly when companies like Intel Corp., Samsung Electronics or Taiwan Semiconductor Manufacturing Co. make their first chips using 7nm, 5nm, 3nm or 2nm process technologies. But we do know what should happen before leading semiconductor producers manufacture their new chips using ultra-thin process technologies: ASML should sell …
Read More »TSMC to have four EUV scanners in 2015, to use EUV tools for 10nm chips
Taiwan Semiconductor Manufacturing Co. has ordered two additional extreme ultraviolet (EUV) lithography scanners from ASML Holding. The equipment will be delivered in 2015 and will complement initial two EUV scanners TSMC has today, which will be upgraded. Four scanners will let TSMC make chips using 10nm process technology and EUV lithography …
Read More »ARM and TSMC expect first 10nm tape-outs in late 2015
ARM Holdings and Taiwan Semiconductor Manufacturing Co. on Thursday outlined some details regarding transition of chip production to 10nm FinFET manufacturing technology. The company’s reaffirmed that risk production of chips made using 10nm FF fabrication process will start in late 2015. The two companies agreed to work together on 10nm FinFET …
Read More »TSMC to speed up development of 10nm process technology
In a bid to retain its leadership position on the market of contract semiconductor manufacturing, Taiwan Semiconductor Manufacturing Co. is reportedly accelerating development of its 10nm FinFET process technology. At present TSMC is the leading contract maker of chips produced using 28nm process technology. It is believed that the company makes considerably …
Read More »TSMC extends 28nm chip lead time to 16 weeks, puts chip designers at risk
Taiwan Semiconductor Manufacturing Co. has extended lead time for production of chips using 28nm process technology from ten to 16 weeks recently, a media report reads. The company reportedly claimed that the demand for 28nm manufacturing process is very high and therefore orders placed in May would take more time …
Read More »TSMC reveals new 16nm FinFET+ process, vows to start 10nm production in Q4 2015
Taiwan Semiconductor Manufacturing Co. this week unveiled an improved version of its 16nm FinFET process technology that will hit volume production in 2015. In addition, the company revealed some details regarding its 10nm FinFET fabrication process and said that it would start risk production using the technology in Q4 2015, …
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