Samsung's upcoming flagship, the Samsung Galaxy S6, is expected to ditch Qualcomm's Snapdragon 810 in favor of its home made Exynos 7420 CPU, which has now been benchmarked, giving us a peak at the device's potential performance.
As we reported previously, Samsung may be moving away from the Snapdragon 810 due to overheating issues. As a result, the Exynos 7420 will take its place, using the ARM big.LITTLE architecture. The clock speed measured on the benchmarks was 1.50 GHz, although this may be due to four A-53 cores being utilized, the final clock speed is expected to be closer to 3.0 Ghz.
The Samsung made Exynos chip managed to score 1520 points on a single core test and 5478 points on the multi core test on Geekbench. The device was also using 3GB of RAM, rather than the rumored 4GB.
This Geekbench comparison shows the performance difference between the Snapdragon 810 running at 1.55GHz in the LG G Flex 2, versus the Exynos 7420 running at 1.50 GHz, so far the advantage seems to be leaning in Samsung's favor, although these aren't the final speeds.
Despite the likelihood of Samsung going with its Exynos chip for the Galaxy S6, it will probably also launch a Snapdragon 810 model as well in certain territories, something it has done in the past.
Discuss on our Facebook page, HERE.
KitGuru Says: Some device manufacturers appear to be having issues with the Snapdragon 810 heat output, which is causing some delays. The One Plus One 2 has been pushed back as well. However, yesterday it was reported that Qualcomm may be working to provide an improved version of the chip with better temperature control features.
Via: TechRadar, Trusted Reviews
I.E. Qualcomm working on new throttling techniques.
As a custom ROM developer and enthusiast, I won’t touch another Exynos chipset.
not trying to be mean but genuine question why not?
Because AOSP based ROMs have nothing but issues running on Exynos devices. I.E. The Galaxy S2 and Galaxy S3. The I9500 S4 has some issues too, whereas the Qualcomm S4 (i9505) runs great.
Just make the back of the phone out of Copper with nickle platting. Connect the CPU to the back of the phone with heat pipe instant heatsync…