Toshiba's XG6 is built on a single sided M.2 2280 format. The label on top of the components is unusually thick which makes you think that it may contain a cooling aid such as a copper layer – it doesn't, it's just a thick label.
The 1TB XG6 uses two NAND packages each containing eight 512Gb BiCS4 3D TLC dies. Next to these on the PCB sit the TC58NCP090GSB 8-channel controller and a 512MB Nanya LPDDR3 cache IC.