Samsung Electronics on Wednesday introduced the industry’s first memory solution that integrates dynamic random access memory (DRAM) and NAND flash into one package. The new package will help Samsung and its customers to make smartphones thinner and more cost efficient.

The new ePoP (embedded package on package) memory package consists of 3GB LPDDR3 DRAM, 32GB eMMC (embedded multi-media card) and a controller. The extremely thin ePoP combines all essential memory components into a single package that can be stacked directly on top of the mobile application processor, without taking any additional space, a significant improvement over existing two-package eMCP memory solutions. The 3GB LPDDR3 mobile DRAM inside the ePoP operates at data transfer rate of 1866Mb/s, and sports a 64-bit I/O bus.

Modern application processors for smartphones need 225mm² (15*15mm) of space. A conventional PoP, consisting of the AP and DRAM, along with a separate eMMC (11.5mm*13mm) NAND flash package, takes up to 374.5mm². Replacing that set-up with a Samsung ePoP decreases the total area used by approximately 40 per cent to 225mm². As a result, it is possible to install more components or a larger battery into a smartphone. Previously Samsung offered ePoP for various wearable electronics devices.

“By offering our new high-density ePoP memory for flagship smartphones, Samsung expects to provide its customers with significant design benefits, while enabling faster and longer operation of multi-tasking features,” Jeeho Baek, senior vice president of memory marketing at Samsung Electronics. “We plan to expand our line-up of ePoP memory with packages involving enhancements in performance and density over the next few years, to further add to the growth of premium mobile market.”

The new configuration for phones can be re-configured not only for use in flagship smartphones but also in other advanced mobile devices such as high-end tablets, in collaboration with global mobile companies.

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KitGuru Says: While Samsung’s ePoP solution is clearly promising, Samsung will have to offer multiple versions of such packages to address various devices and market segments. Thanks to high level of integration, the new packages will have a huge potential on the market.

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