Home / Component / CPU / Intel has joined forces with AMD, bringing Radeon graphics to new 8th Gen Core H-series processors

Intel has joined forces with AMD, bringing Radeon graphics to new 8th Gen Core H-series processors

In December 2016, word began circulating that Intel would be using AMD's graphics technology in the future CPUs to replace its own integrated graphics. Over the months, both Intel and AMD stayed tight lipped on the subject and now, it looks like the rumours were true all along. Today, Intel announced its new Core H-series processors, featuring Intel's own CPU cores, as well as a semi-custom GPU design from AMD's Radeon Technologies Group, all on the same chip.

Intel's Christopher Walker made the announcement today, stating that these new Core H-series processors will pave the way for thinner and lighter enthusiast laptops. These new processors will be part of Intel's 8th Gen Core family, combining the CPU with HBM2 and a Radeon GPU in one package. This will save up a lot of space on the motherboard previously used by discrete components, which will free up OEMs to shrink down high-performance laptop sizes. Alternatively, we could see bigger batteries, or beefier cooling solutions put in place.

Image credit: Intel

Intel worked closely with AMD's Radeon Technologies Group to design the semi-custom graphics chip being used. As Intel puts it, this is a prime example of how the two companies can “compete and work together, ultimately delivering innovation that is good for consumers”.

AMD's VP and GM of RTG, Scott Herkelman, added a statement of his own: “Our collaboration with Intel expands the installed base for AMD Radeon GPUs and brings to market a differentiated solution for high-performance graphics. Together we are offering gamers and content creators the opportunity to have a thinner-and-lighter PC capable of delivering discrete performance-tier graphics experiences in AAA games and content creation applications.”

While the AMD collaboration will be the biggest takeaway from this announcement, Intel is keen to point out that its new Embedded Multi-Die Interconnect Bridge is at the heart of the design. This small intelligent bridge allows information to be passed in extremely close proximity while also eliminating various manufacturing and design complexities. With EMIB in place as well as a new power-sharing framework, the new Core H-series should be extremely efficient and powerful at smaller sizes than ever before.

There are no specific performance numbers yet but these new Core H-series processors should start showing up in laptops at some point in Q1 2018.

KitGuru Says: Just when you think AMD can't possibly have anything left to announce this year, something new comes along. It will be very interesting to see how Intel's new Core H CPUs perform, particularly up against AMD's new Ryzen Mobile processors, which includes Vega Integrated Graphics. 

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9 comments

  1. Nikolas Karampelas

    Smart move, they noticed that ryzen live up to the hype early on and they decided to do something to be able to compete with the mobile ryzen apus that are coming.
    They couldn’t do this with nvidia since they are in very bad terms but amd is open for business with everyone (it is not like they can do otherwise).
    A really win-win for amd here, no matter who sell more they get their gpus in both systems with intel and amd cpus and make money from both and increase their vital market share (because really, consumers are idiots, they just take what most people have, not what it is good for them).

  2. Intel a few months ago: AMD is gluing together their server CPUs.
    Glue is terrible, just horrible. It results in unpredictable
    performance

    Intel today: We are going to glue AMD GPUs onto our
    CPUs because glue is amazing. Hell, we are going to glue our entire
    processors together! We love glue!

    You have to wonder if there
    were a bunch of Intel engineers that knew this was in the pipeline that
    just facepalmed as hard as they could when they saw the infamous “glue”
    marketing slide.

  3. I think people need to look at the bigger implications here. Nvidia and AMD certainly don’t want to pay for those big interposers and the expensive packaging moving forward. Perhaps Navi and Volta’s successor will be packaged at an Intel plant in the future since EMIB is so much cheaper. And, Intel can make ARM, Imagination, Nvidia, and AMD compete to provide solutions for its integrated packages.

    Even further, in the heterogeneous SOC world in HPC, Intel can provide the cheapest packaging by far, so maybe AMD’s HPC APUs will come to find a home in Intel’s packaging plants down the line.

    Intel is laughing all the way to the bank on being the one to patent this.

  4. Oh no, the big winner is Intel. See above.

  5. Nikolas Karampelas

    I’m not well aware of this level of chip making, but I expect others chip foundries to come up with something to compete, if they don’t…. we are all screwed

  6. They can’t. Intel’s patented it for both sides of the die. And we’re not screwed. The patent will expire in 20 years. Worst case scenario is we get in-die cooling to handle 3D chips. And this is still way cheaper than interposer packaging. Intel will compete to be cheaper than that regardless of all else. Why is the world screwed when Intel innovates? Sheesh.

  7. Nikolas Karampelas

    the world is screwed when there is only one player in the field. Like intel was asking for whatever they pleased for i7 before the ryzen and every update was 5-10% better in cpu space.
    If there is no competition they do as they please, and they please to make more money with less effort.

  8. Arrr… Arrr… Me never thought this turned real…. Ho… Ho…
    https://uploads.disquscdn.com/images/8328b261a0fdd0e83c6c62f1c365cba42b6ef83fdd87a8606065170002e67be0.png

  9. Arrr… Intel was first to use glue on x86…. Ho… Ho…
    https://uploads.disquscdn.com/images/3b6c253f0162c42d671074d12682685e240c5adcf3b9f1d6af4f98553e4a682e.jpg