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Just as promised, last night AMD went live with its CES 2023 keynote, unveiling new hardware for laptops, new Ryzen AI technology and a new wave of Ryzen processors for desktops.
In recent days, we've seen companies like Asus announcing laptops with new Ryzen ‘Zen 4' processors. Now at AMD's keynote, these chips have been officially detailed. This year, new laptops will be powered by the Ryzen 7045HX series with up to 16 cores and 32 threads, built using 5nm technology and with DDR5 memory support. These HX processors will be reserved for high-end laptops packing desktop-replacement specs. For the rest of the market, we'll have the new Ryzen 7040 series mobile processors, featuring up to eight Zen 4 cores, as well as integrated RDNA 3 graphics. These CPUs will power ultrathin laptops.
Check our the presentation slides in the gallery below:
These new Ryzen mobile processors will also feature AMD's new Ryzen AI technology. For the first time, AMD is adding in dedicated AI-accelerating hardware to its CPUs, utilising the AMD XDNA architecture, paving the way for real-time AI experiences in a portable form factor. There is also a new wave of Radeon RX 7000 series GPUs for laptops, aiming to deliver 1080p gaming at ultra settings on the go.
With these new laptops launching, there will be a new wave of ‘AMD Advantage' machines, packing both AMD CPUs and GPUs. We've already seen new AMD Advantage laptops announced by companies like Asus, MSI, Acer and others, so expect more in the coming days as additional laptops get announced.
With Ryzen 5000, AMD launched its first X3D processor, utilising 3D V-Cache. We only got one SKU back then but a new wave of X3D CPUs are now on the way for Ryzen 7000. There will be a Ryzen 9, Ryzen 7 and a Ryzen 5 option, all featuring 3D V-Cache technology, which can provide a nice performance boost for memory-demanding tasks, like gaming.
Alongside the new X3D desktop processors, AMD is also launching its new lower-TDP Ryzen 7000 desktop CPUs. The non-X Ryzen 7000 chips all operate with a 65W TDP instead, cutting down on power draw for more efficient computing.
Finally, on the data centre front, AMD had two products to show. First we have the new AMD Instinct MI300, the world's first integrated Data Center APU, offering a 3D chiplet design, CDNA 3 architecture, Zen 4 CPU cores and HBM memory to bolster HPC workloads. Finally, there is also the Alveo A70 AI Accelerator, which AMD says is the world's most energy-efficient video analytics AI accelerator for data centre and cloud deployments, based on the XDNA architecture.
KitGuru Says: AMD's CES announcements brought plenty of new hardware that we'll have the opportunity to put to the test over the coming months.
