Qualcomm is making a bold move in the PC processor market with its upcoming high-end CPU for Windows PCs. Rumoured to boast a significant increase in core count compared to its flagship predecessor, the next generation flagship processor is expected to feature 18 CPU cores.

Import-export documents to which Winfuture had access indicate that reference designs for PCs based on the “Snapdragon X Elite Gen 2” are currently being evaluated, including a platform known internally as “Project Glymur”. These documents also state that the new chip, internally identified as SC8480XP, has 18 CPU cores. The test systems pair this CPU with 48 GB of LPDDR5 RAM from SK Hynix and a 1 TB NVMe SSD.

While details about the specific core types and clock speeds remain unknown, the documents mention a “high-TDP” variant. With the increased core count, the TDP may even go above the 80W limit of the first-generation Snapdragon X Elite. Another detail worth mentioning is Qualcomm's packaging approach. The import-export entries use the abbreviation “SIP”, which stands for “system-in-package”. This suggests that the CPU and crucial components like the LPDDR5 RAM and SSD memory chips might be integrated into a single package.

While a specific launch date remains unconfirmed, current information suggests that Qualcomm's new flagship processor won't be widely available until next year. Previous reports indicated that Qualcomm tested the upcoming CPU with a cooling solution similar to an all-in-one liquid cooler with a fan. More recently, the name “Snapdragon X2 Ultra Premium” has surfaced, though it's unclear if it relates to the final marketing name.

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KitGuru says: Although the specs for the new generation of Qualcomm processors look promising, independent testing suggests that the biggest problem with the first Snapdragon X chips was more related to software and drivers. Hopefully, Qualcomm will also improve on that side, introducing a new player to a market in dire need of more competition.

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