AMD Ryzen 9000 CCD will reportedly pack 27% more transistors than predecessor

AMD recently provided a comprehensive overview of the Zen 5 architecture and CCD sizes during the Zen 5 Tech Day event. The company unveiled that the CCD, known as Eldora, houses up to 8 Zen 5 cores and measures 70.6mm², nearly identical to the Zen 4 CCD (71mm²). Despite the similar dimensions, significant architectural enhancements have been incorporated, setting the stage for future Zen generations.

While many parameters remain consistent with Zen 4, such as core count, IOD, and cache size, improvements in the manufacturing node have enabled AMD to increase the transistor count with its latest core architecture.

While Zen 4 relies on the TSMC 5nm FinFET node, Zen 5 is built on the TSMC 4nm FinFET node (N4P). The exact transistor count within the Zen 5 CCD has not been officially confirmed. Still, HardwareLuxx claims it packs 8.315 billion transistors in its 70,6 mm² die. That equates to a density of 117.78 MTr/mm² and a 26.8% transistor count increase over its predecessor.

Furthermore, AMD has officially announced that Strix Point's monolithic die will measure 232.5mm², representing a 30.6% increase over Phoenix1. Unfortunately, we don't know the exact transistor count to calculate the transistor density within the die. AMD's new desktop and laptop processors are scheduled to be released by the end of this month.

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KitGuru says: Ryzen 9000 is just around the corner, so stay tuned for more news, reviews and updates. 

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