Thermaltake is extending its Level 20 chassis range with two new additions. Both the Level 20 HT and HT Snow Edition takes Thermaltake’s latest case innovations and wraps them in a completely unique modern design that stands out from the traditional black box appearance.

The new Level 20 cases feature durable 4mm thick tempered glass panels and two pre-installed 140mm fans in the top to aid system ventilation. The vertical mounting design of the Level 20 premium chassis offers users extensive options when it comes to custom water cooling and expansion capabilities.

Thermaltake’s Level 20 HT/HT Snow Edition follows the general design DNA of the Level 20 chassis structural aesthetics, but with a vertical tower body. Components are installed in chambers which allows for maximum ventilation and space management. The Level 20 HT/HT Snow Edition comes with tempered glass panels on the top, front and both sides to provide the ultimate viewing angles of the internals. Front and top glass panels unlock by pressing down on the quick release mechanisms with both side panels mounted on hinges for easy access to components.

Reduction of dust build-up has been catered for in the Thermaltake Level 20 HT/HT Snow Edition. Magnetic dust filters are located on the back and at the base to ensure a dust-free environment inside the chassis. The new Level 20 chassis offer great hardware compatibility, allowing users to build the most high-end systems into the Level 20 HT/HT Snow Edition. Motherboards up to E-ATX are supported, CPU air coolers up to 260mm tall can be installed and Multiple GPUs up to 400mm long can be vertically mounted.

The Level 20 HT/HT Snow Edition is optimised for efficient cooling performance and smooth airflow. In addition to the two pre-installed 140mm fans up top, the chassis can accommodate up to three 120mm fans in the bottom and two 120mm in the side or two 120mm/140mm on the top, side or rear depending on user preference. Front I/O ports are located at the top right of the Level 20 HT/HT Snow Edition and feature USB 3.0 and 2.0 connectivity, along with a single USB 3.1 Type-C port.

Another key feature of the Thermaltake Level 20 HT/HT Snow Edition is the Dismantle Modular Design, which offers simple installation of components with removable modular panels, racks and brackets to install hardware to outside of the case, meaning there are no hard to reach screws or fixings.

The Thermaltake Level 20 HT/HT Snow Edition is available to pre-order now. The Level 20 HT is priced at £194.99 and the Level 20 HT Snow Edition is a little more at £204.95 at Overclockers UK.

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KitGuru says: Thermaltake has many options across the Level 20 range now. These new additions look particularly interesting with the vertical design adding a different look to the internal PC hardware layout which can be seen from many angles with the multiple tempered glass panels.

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