Home / Component (page 326)

Component

Corsair Obsidian 450D Chassis Review

The Obsidian Series 450D has an elegant brushed aluminium front panel and a solid steel body. The interior is designed for superior cooling efficiency, with a modular removable drive cage system and dual SSD bays that mount behind the motherboard tray and out of the airflow path. I have to …

Read More »

Toshiba, SanDisk start mass production of 15nm NAND memory

Toshiba Corp. and SanDisk Corp. on Wednesday said that they would start to produce multi-level cell (MLC) NAND flash memory using 15nm fabrication process later in April. The new manufacturing technology allows Toshiba to make world’s smallest and potentially cost-efficient 128Gb NAND flash memory. Initially, Toshiba and SanDisk will produce …

Read More »

AMD shows off next-generation Opteron X “Berlin” APU in action

Advanced Micro Devices this week demonstrated its next-generation AMD Opteron X-series accelerated processing unit code-named “Berlin” running Fedora Linux operating system. The new APU is projected to significantly boost performance of servers running APUs and bring heterogeneous system architecture (HSA) capabilities to servers. AMD Opteron X-series “Berlin” APU in many …

Read More »

GlobalFoundries and Samsung to jointly produce 14nm FinFET chips

GlobalFoundries and Samsung Semiconductor, two leading contract makers of chips, on Thursday signed a pact under which they will be able to jointly produce chips using 14nm FinFET fabrication process. The two foundries will “synchronise” not only their general jointly-developed process technologies, but peculiarities of their manufacturing processes that are …

Read More »

Intel to start making ‘Skylake’ microprocessors next year

Intel Corp. said this week that despite the delay that occurred to mass production of the code-named Broadwell microprocessor, the company is on-track to start manufacturing of chips based on the all-new next-generation micro-architecture known as Skylake in 2015. “We have a lot going on, the ramp of Broadwell, the …

Read More »

Launch date of Intel Core “Haswell Refresh” chips revealed

While it was pretty obvious that Intel Corp. plans to start selling its new code-named “Haswell Refresh” central processing units sometimes in April or May, the actual launch date was not completely clear. Apparently, that will happen in exactly one month time. Intel plans to start selling its improved Core …

Read More »

Intel transforms operations in Costa Rica, set to fire 1500

Intel Corp. this week announced that it would relocate its test assembly and test operation to Asia from Costa Rica. As a result, it would fire about 1500 of its employees in the country. Still, Intel's engineering and design center and shared services operations will remain in Costa Rica. Intel …

Read More »

Micron Technology promises TLC NAND flash memory in Q4 2014

Micron Technology, one of the world’s leading maker of DRAM and NAND flash memory, said that late this year the company would offer triple-level cell NAND flash made using 16nm process technology. Such memory could enable very cost-efficient flash-based storage devices, including solid-state drives in 2015. “Our 16nm NAND yields …

Read More »