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EVGA GeForce GTX 980 hits 2.30GHz, sets new records

Nvidia Corp.’s code-named GM204 graphics processing unit has once again managed to set a new frequency record for graphics processing units. A well-known overclocker has succeeded in pushing the frequency of the GPU to 2.30GHz clock-rate, but could not eventually replicate the record because of high humidity. Steponz, a leading …

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The BitFenix Aegis Core and Icon editions are now available

The full colour range of the BitFenix Aegis desktop PC case is now available at Overclockers UK. There are two versions of the case available, the Icon edition, which comes with a small colour display built-in, allowing you to display a custom logo and the Core edition, which does not …

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DRAM will remain in short supply this year – analyst

Even though Samsung Electronics plans to increase its manufacturing capacities for dynamic random access memory later this year, analysts believe that this will not create an oversupply on the DRAM market. The reasons for that are transitions to bigger memory dies as well as growing demand for higher memory capacities …

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TSMC: We will close the gap with Intel at 10nm!

Taiwan Semiconductor Manufacturing Co. believes that its 10nm fabrication process will not only be available around the same time when Intel Corp. starts to use its 10nm technology, but will also offer similar performance and density as Intel’s. In a bid to speed up time-to-market of their manufacturing processes featuring FinFET …

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Samsung: 10nm technology in development, 7nm will require new transistors

Kinam Kim, the president of Samsung Electronics’ semiconductor business, presented his view on the development of chip manufacturing technologies at the International Solid-State Circuits Conference 2015 this week. Samsung is already developing its next-generation 10nm FinFET fabrication process, but in order to continue scaling down structures of chips, new materials …

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AMD details ‘Carrizo’: High-density design, lowered power consumption

At the International Solid-State Circuits Conference 2015 Advanced Micro Devices unveiled the first official details regarding its code-named “Carrizo” accelerated processing units. As reported, the new chips are aimed specifically at notebooks and therefore were designed from the ground up to be extremely power efficient and integrate all functionality possible. …

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OCZ Challenge update: 3rd ARC 100 drive dies at 384TB

Given the nature of SSD technology, one sure fire way to check reliability is to run massive amounts of data through them – which is what we started to do with five OCZ ARC 100s back on December 10th. Here's the latest update from KitGuru Labs. The warranty term for this kind …

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AMD seeking CPU performance engineer to optimize GPU drivers

Advanced Micro Devices is hiring a microprocessor performance engineer to optimize its Catalyst drivers for graphics cards. The programmer will help to optimize AMD drivers to boost performance of Radeon graphics adapters in cases where CPU is a major performance-limiting factor. The CPU performance engineer will have to analyze CPU bound …

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AMD’s ‘Zen’ could sport Intel’s ‘Skylake’ features, new 512-bit FPU – rumours

Although microprocessors based on AMD’s next-generation high-performance micro-architecture code-named “Zen” are more than a year away, some details regarding the forthcoming chips and “Zen” in general are beginning to surface. The most recent rumours about the new architecture add some technical details and point to release schedule of the new …

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Qualcomm fits-in ARM Cortex-A72, 4K support into mainstream SoCs

Qualcomm, the world’s largest supplier of mobile application processors, has introduced its new lineup of mobile system-on-chips for mainstream smartphones, tablets and other devices. The new Snapdragon 600-series application processors feature ARM’s latest Cortex-A72 cores, support 4K video capture and playback, advanced storage technologies, a number of other high-end features …

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Intel could delay ‘Skylake-S’ processors to October – document

Intel Corp. has set a very broad product introduction window for its code-named “Skylake-S” microprocessors that it allows the chipmaker to release its new microprocessors as late as in October, which means rather limited availability of such desktop chips this calendar year. An excerpt presumably from an Intel’s document for …

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Asus USB 3.1 Hands-on Preview

The widespread introduction of USB 3.1-capable components is already under way. That roll-out is currently centred around motherboards providing support for the 10Gbps ports, but further devices will make use of the higher speed connector in coming months. We get an early hands-on look at one of Asus' upcoming USB …

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Asrock to add USB 3.1 to mainboards using add-in-cards

Asrock has announced two mainboards with USB 3.1 interconnection technologies. The motherboards will support Intel Corp.’s processors and will add USB 3.1 connectors using add-in-cards. It is unclear whether the boards will be sold separately to add USB 3.1 support to older systems. The family of Asrock’s mainboards with USB …

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