Memory

TeamGroup has announced the availability of its T-Force Vulcan Z and Dark Z gaming memory in large single stick capacities. From today TeamGroup's T-Force Vulcan Z and Dark Z DDR4 gaming memory will be available in single modules of 32 GB capacity in single-channel and dual-channel kits. The new 32 …

Samsung's new eUFS 3.1 storage will produce three times write performance in mobile devices compared to current eUFS 3.0.

PC component manufacturer GeIL has announced plans to make its products more accessible to the UK market by entering a new partnership with UK based online retail outlets that will expand the GeIL brand across the United Kingdom. In-demand GeIL products will now become available at a handful of UK-based …

Kingston has announced a refresh of its Canvas series SD and microSD cards along with new MobileLite Plus card readers today. The new Canvas Plus SD series includes Kingston’s first UHS-II card while MobileLite Plus UHS-II readers have been engineered to support these new high-speed cards. The new Canvas Plus …

Rambus has announced a new addition to its range of High-speed memory interface solutions with a new High Bandwidth Memory 2E controller and a physical layer IP to deliver maximum performance in a compact, power-efficient package. The new HBM2E controller and PHY IP from Rambus provides customers with a complete …

Western Digital has launched its new iNAND EU521 embedded Universal Flash Storage designed to assist mobile developers to enhance the 5G smartphone experience for users, which makes Western Digital one of the first manufacturers to offer USF 3.1 5G applications and capabilities in commercial storage solutions, with its support for …

Kingston has announced that its IronKey D300 Encrypted USB Flash Drive series has been awarded NATO Restricted Level Certification, making it one of the most secure USB Flash Drives available. After a thorough and detailed validation process, the Kingston IronKey D300, D300S and D300M have been listed in the NATO …

SMART Modular has launched a new series of low profile DDR4-3200 Mini-DIMMs designed for industrial applications. The Mini-DIMM range now includes 32GB registered and unbuffered EEC modules in both Ultra Low Profile (ULP) and Very Low Profile (VLP) formats. The new series of Mini-DIMMs from SMART modular have been extensively …

Though the PlayStation 5 is set to be released in less than a year, not much is currently known about the console. One of the most important aspects of the console, its price, has been kept rather secretive, with Sony only going so far as to say the price will …

Intel has been celebrating another milestone recently, the company’s memory and storage group announced that last week, it had produced the number 10 million of its QLC 3D NAND based solid-state drive manufactured with the QLC NAND die. Production of the Intel QLC 3D NAND began in Dalian, China late …

G.SKILL has announced a new range of DDR4 memory modules designed specifically to deal with the high demands of the AMD Ryzen Threadripper 3000 platform, with new high-capacity, low latency memory kits being prepared now, ready for shipping in Q2 2020. The new memory kits added to the G.SKILL Trident-Z …

Golden Emperor International Ltd, the company more commonly known as GeIL has announced the availability from retailers in the Americas of its new EVO SPEAR memory series, sporting the ASRock Phantom Gaming branding. GeIL memory and ASRock have joined forces to build a strong foundation for compatibility between motherboard and …

Gigabyte’s Designare brand aimed at content creators has been expanded this week and now includes a range of memory modules sporting the Designare name, along with a sleek looking white aluminium heat spreader. Designare memory kits from Gigabyte comprise of common dual-rank modules that are fully compliant with industry-standard JEDEC …

Micron has announced the production of the world’s first low-power DDR5 RAM. The first batch of LPDDR5 from Micron will be used in the upcoming Xiaomi Mi 10 Smartphone to provide superior power efficiency and significantly faster data access speed. The new LPDDR5 RAM from Micron is designed to address …

Samsung has announced its 3rd generation HBM2E “Flashbolt” memory this week. The latest generation of High Bandwidth Memory 2 is designed to maximise computing performance for HPC systems and assist manufacturers to advance their supercomputer designs. Samsung’s new “Flashbolt” HBM2E will provide double the capacity of the previous generation 8GB …

What does Leo think of this new memory kit from G.Skill?

Micron, the parent company of Crucial memory has announced the next generation of Ballistix gaming memory. The new RAM leverages a performance-tuned Micron die to provide high-speed memory with low latency. A new portfolio of Crucial Ballistix gaming memory designed for gamers and extreme overclockers has been unveiled by Micron …

Gigabyte has been relatively quiet at CES 2020 so far but today the company has announced a range of new gaming monitors, high-speed memory, portable storage devices and the world’s first liquid-cooled eGPU are being showcased in Las Vegas. Gigabyte will unveil a new affordable gaming monitor series at CES …

Following on from our earlier coverage of Thermaltake introducing the brand new DistroCase 350P at CES 2020, Leo takes a tour around the rest of the Thermaltake booth to check out what else is in store from the company in 2020. First off, Leo takes a look at the innovative …

ThermalTake began showing off its new TOUGHRAM DDR4 modules at Computex last year, with enhanced RGB lighting features, a 10-layer PCB and pre-binned memory ICs to ensure performance. Over the second half of 2019, speeds were consistently improved, with kits now available all the way up to 4400MHz.  Each of …

Storage and multimedia products manufacturer Transcend has announced a new line of high performance, high endurance USB flash drives. The Transcend JetFlash 910 series offer high performance and large capacity in a compact USB device. The Transcend JetFlash 910 is manufactured using the latest 3D NAND technology to provide up …

It has been quite a year for G.Skill, with new memory kit launches, the annual overclocking world championship and the expansion of the Trident Z Royal line of DDR4 kits. To cap off 2019, G.Skill has another launch, delivering ultra low-latency DDR4 memory kits in configurations up to 256GB. CL14-18-18-38 …

Kioxia recently announced it has developed a new flash memory cell structure. Twin BiCS FLASH is the world’s first three-dimensional semicircular split-gate flash memory cell structure using specially designed semi-circular Floating Gate cells. The new memory cell structure from Kioxia achieves greater program slope and larger program/erase windows with a …

CES 2020 is just a couple of weeks away and here at KitGuru, we are starting to get excited about what new hardware will be unveiled at the event. One thing that is for sure, Thermaltake will be at CES showcasing its new products. CES is one of the biggest …

Adata has announced it is introducing a new line of XPG DDR4 memory modules to its current range. The new XPG Hunter DDR4 series is geared towards gamers and PC enthusiasts looking for high-performance DDR4 memory solutions. The new XPG Hunter series from Adata offers remarkable performance and efficiency. Overclocking …

Adata’s XPG range has provided gamers and enthusiasts with high-performance memory for recent generations of desktop PC systems. The excellent compatibility of Adata XPG memory is set to continue through support for the latest AMD Ryzen 3950X and Threadripper 3000 based systems. Adata has announced that it's XPG DDR4 memory …

ThermalTake began showing off its new ToughRAM DDR4 modules at Computex earlier this year, with enhanced RGB lighting features, a 10-layer PCB and pre-binned memory ICs to ensure performance. Since then, the lineup has expanded to hit different speed/price points and today, another new kit is being added- the TOUGHRAM …

TeamGroup has established its T-force RAM as one of the most high-performance brands on the market, making it popular with gamers and enthusiasts who want to extract every ounce of performance from their rigs. The company has now launched the world’s first mirror design ARGB gaming memory. TeamGroup’s gaming division …

Samsung has become the first tech company to receive global recognition for environmental sustainability of its semiconductor solutions with its 512GB eUFS 3.0 memory, earning the Carbon Footprint and Water footprint certifications. The company announced its 512GB embedded Universal Flash Storage 3.0 has been awarded Carbon Footprint and Water Footprint …

G.Skill has announced its new quad-channel memory kits for HEDT platforms, both Intel X299 and AMD TRX40, with capacities of 64GB DDR4 RAM and 256GB DDR4 RAM. The 256GB memory kits use high-density 32GB modules, maximising the amount of RAM in your system. There is a total of four memory kits …