SMART Modular has launched a new series of low profile DDR4-3200 Mini-DIMMs designed for industrial applications. The Mini-DIMM range now includes 32GB registered and unbuffered EEC modules in both Ultra Low Profile (ULP) and Very Low Profile (VLP) formats. The new series of Mini-DIMMs from SMART modular have been extensively …
Read More »The PlayStation 5 reportedly costs $450 to manufacture, due to scarce NAND and DRAM components
Though the PlayStation 5 is set to be released in less than a year, not much is currently known about the console. One of the most important aspects of the console, its price, has been kept rather secretive, with Sony only going so far as to say the price will …
Read More »Intel produces 10 million QLC 3D NAND based solid-state drives
Intel has been celebrating another milestone recently, the company’s memory and storage group announced that last week, it had produced the number 10 million of its QLC 3D NAND based solid-state drive manufactured with the QLC NAND die. Production of the Intel QLC 3D NAND began in Dalian, China late …
Read More »G.SKILL announce high capacity memory kits for AMD Ryzen Threadripper
G.SKILL has announced a new range of DDR4 memory modules designed specifically to deal with the high demands of the AMD Ryzen Threadripper 3000 platform, with new high-capacity, low latency memory kits being prepared now, ready for shipping in Q2 2020. The new memory kits added to the G.SKILL Trident-Z …
Read More »GeIL Launches EVO SPEAR Phantom Gaming Edition DDR4 memory
Golden Emperor International Ltd, the company more commonly known as GeIL has announced the availability from retailers in the Americas of its new EVO SPEAR memory series, sporting the ASRock Phantom Gaming branding. GeIL memory and ASRock have joined forces to build a strong foundation for compatibility between motherboard and …
Read More »Gigabyte introduces Designare memory kits
Gigabyte’s Designare brand aimed at content creators has been expanded this week and now includes a range of memory modules sporting the Designare name, along with a sleek looking white aluminium heat spreader. Designare memory kits from Gigabyte comprise of common dual-rank modules that are fully compliant with industry-standard JEDEC …
Read More »Micron announces its LPDDR5 RAM for mobile devices
Micron has announced the production of the world’s first low-power DDR5 RAM. The first batch of LPDDR5 from Micron will be used in the upcoming Xiaomi Mi 10 Smartphone to provide superior power efficiency and significantly faster data access speed. The new LPDDR5 RAM from Micron is designed to address …
Read More »Samsung unveils its 3rd generation HBM2E ‘Flashbolt’ memory
Samsung has announced its 3rd generation HBM2E “Flashbolt” memory this week. The latest generation of High Bandwidth Memory 2 is designed to maximise computing performance for HPC systems and assist manufacturers to advance their supercomputer designs. Samsung’s new “Flashbolt” HBM2E will provide double the capacity of the previous generation 8GB …
Read More »G.Skill Trident Z Neo Review – Maximum support for AMD Ryzen 3000
What does Leo think of this new memory kit from G.Skill?
Read More »Micron announces the next generation Crucial Ballistix gaming memory
Micron, the parent company of Crucial memory has announced the next generation of Ballistix gaming memory. The new RAM leverages a performance-tuned Micron die to provide high-speed memory with low latency. A new portfolio of Crucial Ballistix gaming memory designed for gamers and extreme overclockers has been unveiled by Micron …
Read More »CES 2020: Gigabyte introduce new gaming monitors, memory, portable storage and a liquid-cooled eGPU
Gigabyte has been relatively quiet at CES 2020 so far but today the company has announced a range of new gaming monitors, high-speed memory, portable storage devices and the world’s first liquid-cooled eGPU are being showcased in Las Vegas. Gigabyte will unveil a new affordable gaming monitor series at CES …
Read More »CES 2020: Custom cooling, new cases and more at Thermaltake’s booth
Following on from our earlier coverage of Thermaltake introducing the brand new DistroCase 350P at CES 2020, Leo takes a tour around the rest of the Thermaltake booth to check out what else is in store from the company in 2020. First off, Leo takes a look at the innovative …
Read More »Thermaltake will be showing off new TOUGHRAM memory at CES
ThermalTake began showing off its new TOUGHRAM DDR4 modules at Computex last year, with enhanced RGB lighting features, a 10-layer PCB and pre-binned memory ICs to ensure performance. Over the second half of 2019, speeds were consistently improved, with kits now available all the way up to 4400MHz. Each of …
Read More »Transcend launch the JetFlash 910 USB flash drive
Storage and multimedia products manufacturer Transcend has announced a new line of high performance, high endurance USB flash drives. The Transcend JetFlash 910 series offer high performance and large capacity in a compact USB device. The Transcend JetFlash 910 is manufactured using the latest 3D NAND technology to provide up …
Read More »G.Skill’s latest Trident Z memory kits offer low latency and up to 256GB capacity
It has been quite a year for G.Skill, with new memory kit launches, the annual overclocking world championship and the expansion of the Trident Z Royal line of DDR4 kits. To cap off 2019, G.Skill has another launch, delivering ultra low-latency DDR4 memory kits in configurations up to 256GB. CL14-18-18-38 …
Read More »Kioxia develops a new semi-circular 3D memory cell structure “Twin BiCS FLASH”
Kioxia recently announced it has developed a new flash memory cell structure. Twin BiCS FLASH is the world’s first three-dimensional semicircular split-gate flash memory cell structure using specially designed semi-circular Floating Gate cells. The new memory cell structure from Kioxia achieves greater program slope and larger program/erase windows with a …
Read More »Thermaltake will be showcasing new products and software at CES 2020
CES 2020 is just a couple of weeks away and here at KitGuru, we are starting to get excited about what new hardware will be unveiled at the event. One thing that is for sure, Thermaltake will be at CES showcasing its new products. CES is one of the biggest …
Read More »Adata unveils XPG Hunter DDR4 memory module series
Adata has announced it is introducing a new line of XPG DDR4 memory modules to its current range. The new XPG Hunter DDR4 series is geared towards gamers and PC enthusiasts looking for high-performance DDR4 memory solutions. The new XPG Hunter series from Adata offers remarkable performance and efficiency. Overclocking …
Read More »Adata XPG memory tested to support AMD Ryzen 3950X and Threadripper 3000
Adata’s XPG range has provided gamers and enthusiasts with high-performance memory for recent generations of desktop PC systems. The excellent compatibility of Adata XPG memory is set to continue through support for the latest AMD Ryzen 3950X and Threadripper 3000 based systems. Adata has announced that it's XPG DDR4 memory …
Read More »Thermaltake shows off new TOUGHRAM Z-ONE RGB memory kit
ThermalTake began showing off its new ToughRAM DDR4 modules at Computex earlier this year, with enhanced RGB lighting features, a 10-layer PCB and pre-binned memory ICs to ensure performance. Since then, the lineup has expanded to hit different speed/price points and today, another new kit is being added- the TOUGHRAM …
Read More »TeamGroup launch the T-Force XTREEM ARGB Gaming memory
TeamGroup has established its T-force RAM as one of the most high-performance brands on the market, making it popular with gamers and enthusiasts who want to extract every ounce of performance from their rigs. The company has now launched the world’s first mirror design ARGB gaming memory. TeamGroup’s gaming division …
Read More »Samsung receives industry’s first Carbon Footprint and Water Footprint certifications
Samsung has become the first tech company to receive global recognition for environmental sustainability of its semiconductor solutions with its 512GB eUFS 3.0 memory, earning the Carbon Footprint and Water footprint certifications. The company announced its 512GB embedded Universal Flash Storage 3.0 has been awarded Carbon Footprint and Water Footprint …
Read More »G.Skill expands its DDR4 memory lineup for HEDT platforms
G.Skill has announced its new quad-channel memory kits for HEDT platforms, both Intel X299 and AMD TRX40, with capacities of 64GB DDR4 RAM and 256GB DDR4 RAM. The 256GB memory kits use high-density 32GB modules, maximising the amount of RAM in your system. There is a total of four memory kits …
Read More »Corsair announces its ‘Threadripper Ready’ components
Yesterday, Corsair announced a set of components that have been validated to work in a 3rd Gen AMD Threadripper build, just in time for the new Threadripper processors' release. All of these components were tested and validated to work with the new HEDT CPUs. Readying for the new AMD Threadripper …
Read More »Micron introduce high-capacity industrial grade microSD cards
Micron claims it has eliminated the need for network video recorders after the company has announced it is launching the world’s first industrial-grade microSD card for cloud-managed video surveillance. The Micron i300 1TB microSDXC UHS-I was unveiled by the company which is said to be the world’s highest-capacity industrial microSD …
Read More »Rambus introduces comprehensive PCIe 5.0 interface
Now that PCIe is established in desktop solutions, we are hearing more details about the PCIe 5.0 interface...
Read More »Rambus announces industry’s performance leading GDDR6 memory
Rambus has announced its GDDR6 PHY memory has achieved the industry’s highest performance figures at 18 Gbps. The company also said in the announcement that its PHY GDDR6 memory is best suited to artificial intelligence, machine learning and autonomous driving systems that require higher bandwidth memory. Rambus claims its GDDR6 …
Read More »ThermalTake ToughRAM expands with speeds up to 4400MHz
ThermalTake began showing off its new ToughRAM DDR4 modules at Computex earlier this year, with enhanced RGB lighting features, a 10-layer PCB and pre-binned memory ICs to ensure performance. In September, new kits released to push speeds up to 3600MHz. Now, three more kits are on the way, raising performance …
Read More »Gigabyte expand Aorus memory range with Aorus Memory Boost feature
Gigabyte’s line of Aorus memory offer gamers high-speed DDR4 RAM in 16GB 3200 MHz kits and feature the full range of RGB lighting colours and patterns. Gigabyte is set to expand the lineup with new modules featuring Aorus Memory Boost technology. Two new DDR4 memory kits are being added to …
Read More »Team Group extends product lines and adds more 32GB DIMMs
Team Group has updated its product lines with more 32GB capacity DDR4 modules. The new high-capacity DIMMs will be part of the Elite and Elite plus ranges which are targeted towards content creators and professional use. The company’s Elite and Elite Plus products will now feature 32GB DIMMs rated at …
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