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Memory

From DDR3 to DDR2 to Laptop. Whatever memory you need – check out KitGuru’s opinion before you buy.

Samsung to make TLC 3D V-NAND flash memory

Samsung Electronics plans to wed triple-level cell NAND flash technology with vertical stacking of NAND flash memory. The new type of NAND will be very cost-efficient to manufacture, which will help Samsung to decrease pricing of its solid-state storage solutions, such as memory cards, storage modules, solid-state drives and so …

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DRAM prices to rise by 5% – 10% in the third quarter

Although the price of dynamic random access memory (DRAM) remained rather stable in the recent months, it will increase by 5 – 10 per cent in the third quarter, according to Mark Newman, an analyst with Bernstein Research. Nonetheless, a good news is that the industry will likely move to …

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Gigabyte breaks DDR3 world record with 4.62GHz kit

The world and his dog might be getting ready of the impending availability of DDR4 memory, but Gigabyte is still pushing the boundaries of what you can do with the hardware that's available right now. Making use of its much touted Z97-SOC Force LN2 motherboard, Gigabyte is now proud to let …

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Smart Modular begins to sample DDR4 memory modules

Smart Modular Technologies, a leading independent maker of specialty memory and storage solutions, said Thursday that it has begun shipments of DDR4 memory modules in sample quantities. The DDR4 memory modules are designed for servers, micro-servers, workstations, storage and networking applications. Currently, Smart Modular's lineup of available DDR4-2133 1.2V modules …

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Japanese stores begin to sell DDR4 memory modules

Although the first systems that will need DDR4 memory modules will emerge on the market in several months, at least one store in Japan has already began to offer DDR4 memory sticks. Unfortunately, the price of the memory modules is very high even by Japanese standards. Akiba PC Hotline reports …

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Samsung begins mass production of 32-layer 3D V-NAND memory

Samsung Electronics on Thursday said it had begun mass production of its second-generation three-dimensional (3D) V-NAND flash memory. The new memory is projected to be more cost-efficient that the previous-gen 3D V-NAND thanks to higher integration. The company also unveiled its new series of solid-state drives that are based on …

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Toshiba and SanDisk license technologies for next-gen memory

Toshiba Corp. and SanDisk Corp. on Monday announced that they had licensed intellectual property from Intermolecular. The technologies, which were developed under the collaborative development program (CDP) as well as Intermolecular's background intellectual property, are believed to be crucial for next-generation memory. The companies' CDP with Intermolecular, specifically aimed at …

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Rambus joins JEDEC committee to co-develop next-gen server memory

History always repeats itself. Rambus and JEDEC have a history that began in the early nineties and greatly influenced the whole dynamic random access memory (DRAM) industry in the 2000s and 2010s. That history is about to repeat itself. Rambus, a developer of high-speed interfaces and owner of multiple standard-essential …

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Samsung begins to mass produce 3D V-NAND flash in China

Samsung Electronics, one of the world’s top makers of NAND flash memory, last week announced that its new memory fab in Xi’an China has begun full-scale manufacturing operations. The new facility will produce Samsung’s advanced NAND flash memory chips, such as 3D V-NAND. Vertical NAND (V-NAND) memory stacks memory cells …

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Micron expected to hike DRAM prices this month – report

The prices of dynamic random access memory (DRAM) may start to increase this month as two out of three major computer memory makers are experiencing problems with fulfilling market demands. In case the situation with under-supply of DRAM is not resolved, the high prices will remain for several months down …

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Toshiba, SanDisk start mass production of 15nm NAND memory

Toshiba Corp. and SanDisk Corp. on Wednesday said that they would start to produce multi-level cell (MLC) NAND flash memory using 15nm fabrication process later in April. The new manufacturing technology allows Toshiba to make world’s smallest and potentially cost-efficient 128Gb NAND flash memory. Initially, Toshiba and SanDisk will produce …

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Micron Technology promises TLC NAND flash memory in Q4 2014

Micron Technology, one of the world’s leading maker of DRAM and NAND flash memory, said that late this year the company would offer triple-level cell NAND flash made using 16nm process technology. Such memory could enable very cost-efficient flash-based storage devices, including solid-state drives in 2015. “Our 16nm NAND yields …

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Samsung ramps up volume production of DDR4 memory

Samsung Electronics said Tuesday that it had begun mass production of DDR4 memory modules and chips in anticipation of Intel’s launch of next-generation high-end desktop and server platforms that rely on the new-gen memory technology. Samsung’s DDR4 memory modules are based on the company’s 4Gb DDR4 chips produced using 20nm …

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SK Hynix reveals 128GB DDR4 memory module [UPDATED]

UPDATE: The initial news-story contained an image of an SK Hynix memory module which did not feature 128GB capacity. As SK Hynix has released the correct images of its new memory modules, we can now publish the photos of 128GB DDR4 memory sticks. SK Hynix on Monday unveiled the industry’s …

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Samsung begins to produce DRAM using 20nm process technology

Samsung Electronics on Tuesday said that it had begun mass production of dynamic random access memory using 20nm process technology. The new fabrication tech will not only enable the company to produce more energy-efficient DDR3 memory, but will also reduce manufacturing cost of DRAM and will thus make it more …

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Hybrid memory cube 2.0 to offer up to 480GB/s of bandwidth

The hybrid memory cube consortium (HMCC), an organization dedicated to the development and establishment of an industry-standard interface specification for the hybrid memory cube (HMC) technology, this week introduced version 2.0 of the HMC spec. The second generation of the “cubes” will be able to support bandwidth of up to …

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