Although only a quarter of the size of Intel in terms of overall chip production, Korean memory specialist SK hynix is number two in the memory module business – ahead of companies like Toshiba. As the overall market continues to recover and SK hynix begins to flex its own marketing …
Read More »Samsung begins mass production of 8Gb GDDR5 memory chips
Samsung Electronics on Thursday said that it has begun mass production of 8Gb GDDR5 dynamic random access memory (DRAM) for graphics adapters and game consoles. The new chips will allow makers of graphics cards to build devices with 8GB of memory and will let Sony to simplify design of its PlayStation …
Read More »Micron: We are sampling 8Gb GDDR5 for 8GB graphics cards
Graphics cards with 8GB of memory will likely become relatively widespread this year as another manufacturer of dynamic random access memory (DRAM) has announced that it had begun sampling of 8Gb GDDR5 chips. “We are seeing good progress of our eight gigabit GDDR5 technology as we are shipping engineering samples …
Read More »Micron: DDR4 will remain more expensive than DDR3 this year
Later this year Intel Corp. plans to introduce its new code-named “Skylake” microprocessors that will target mass market segments and will support DDR4 memory. As a result, the latter will gain market share. Nonetheless, DDR4 will remain more expensive than DDR3 in the coming quarters, according to Micron Technology. At …
Read More »G. Skill breaks DDR4 OC record
G.Skill is no stranger to breaking new ground when it comes to memory speed world records, so it shouldn't come as much of a surprise that it's done that once again, this time smashing the DDR4 world record with a frequency of 4255MHz. Unlike some previous records however, this wasn't …
Read More »Toshiba reportedly seeks partnership with Taiwan’s Nanya
Toshiba Corp. is reportedly seeking a partnership with Nanya Technology in a bid to better compete against Samsung Electronics and SK Hynix on the market of multi-chip packages (MCP) for mobile and embedded devices. Toshiba wants to partner with Nanya to secure a stable supply of dynamic random access memory …
Read More »Toshiba to consider overseas location for new chip plant
Toshiba Corp. said last week that it would consider an overseas location for its next NAND flash memory chip plant because currently demand for this memory type exceeds supply. While the company did not reveal where it could build its next fab, it is highly likely that the plant will …
Read More »Samsung begins mass production of LPDDR4 memory for 4K phones
Samsung Electronics has announced that it has started mass production of 8Gb LPDDR4 memory chips for next-generation smartphones based on advanced application processors. The new handsets will feature displays with ultra-high-definition resolutions as well as new-generation system-on-chips, such as Qualcomm Snapdragon 810. At present Samsung manufactures 8Gb and 6Gb LPDDR4 …
Read More »Toshiba and SK Hynix settle NAND flash-related legal dispute
Toshiba Corp. and SK Hynix have announced that they had reached a settlement agreement in connection with a civil lawsuit that the former initiated against the latter at the Tokyo District Court earlier this year. Toshiba accused SK Hynix of stealing intellectual property related to NAND flash memory. As a …
Read More »Overclockers UK slashes £300 from a £1000+ PC DIY bundle
As reported, Overclockers UK has decided to follow its colleagues from the U.S. with special discounts on Black Friday and Cyber Monday. Unlike “traditional” price slashes many of which look rather symbolic, deals on the special days usually result in rather dramatic savings. For example, OcUK will offer a bundle …
Read More »ASML readies equipment to produce 5nm chips
We do not know exactly when companies like Intel Corp., Samsung Electronics or Taiwan Semiconductor Manufacturing Co. make their first chips using 7nm, 5nm, 3nm or 2nm process technologies. But we do know what should happen before leading semiconductor producers manufacture their new chips using ultra-thin process technologies: ASML should sell …
Read More »SK Hynix adds HBM DRAM into catalogue, to start production in Q1 2015
SK Hynix, a major maker of high-performance memory, has added high bandwidth memory (HBM) devices compliant with the JESD235 specification into its product catalogue for the fourth quarter of 2014. The addition of chips into the databook means that they are in production and can be obtained from the company. …
Read More »SK Hynix begins to mass-produce 8GHz GDDR5 memory
SK Hynix, one of the world’s largest makers of dynamic random access memory, has initiated mass production of GDDR5 memory that can operate at 8Gb/s data-rate. The new memory chips are already available for graphics cards manufacturers and will be installed on new graphics adapters. The new GDDR5 memory chips from …
Read More »Intel promises 10TB+ SSDs thanks to 3D Vertical NAND flash memory
At present solid-state drives with extreme capacities are very expensive and even the best of them cannot match high-capacity hard disk drives for nearline storage applications. However, thanks to the evolution of NAND flash memory in general, and 3D vertical NAND (3D V-NAND) in particular, the situation may change soon …
Read More »Kingston doubles capacity on a range of products
We all know that technology drives an endless progression of shrinks and optimisations. Normally, the effects are felt gradually over time. But every now and there's a mini-seismic shift in terms of what's possible at a specific prince point. KitGuru checks the Richter Scale for evidence of just such a …
Read More »Samsung begins to produce 8Gb DDR4 memory, 32GB DDR4 modules
Samsung Electronics has begun to produce 8Gb DDR4 memory chips. The new memory devices will power 32GB DDR4 modules and open the doors to 128GB DDR4 memory modules for high-end enterprise-class servers. The 8Gb DDR4 ICs are produced using 20nm fabrication process. Samsung’s 8Gb DDR4 memory chip can operate at …
Read More »Toshiba and SanDisk will start to ship 3D V-NAND flash in 2016
Toshiba Corp. and SanDisk Corp. will initiate volume production of 3D V-NAND flash memory only in 2016, three years after Samsung Electronics. The first samples of 3D V-NAND from the two companies will become available sometimes in the second half of next year. “Our 3D NAND technology development continues to …
Read More »DDR4 3000MHz Memory Kit Round-up (Featuring Corsair, G.Skill, Kingston)
One of the key technological advancements that the Haswell-E processors and Intel's latest High-End Desktop (HEDT) platform iteration have brought into the consumer limelight is DDR4. We compare three 16GB quad-channel memory kits from Corsair, G.Skill, and Kingston, all running at 3000MHz. Is there a specific set of ‘go-to' memory …
Read More »Samsung does not expect computer memory prices to drop next year
Although Samsung Electronics plans to significantly boost its production capacities in the coming years, the company does not expect prices of dynamic random access memory to drop in 2015. Chief executive officer of the company is confident that DRAM prices will continue to be favourable for manufacturers. “We'll have to …
Read More »Samsung confirms mass production of TLC 3D V-NAND flash memory
Samsung Electronics on Thursday confirmed that it had begun mass production of triple-layer cell (TLC, or 3-bit-per-cell, 3bpc) three-dimensional vertical NAND (3D V-NAND) flash memory. The company will use the memory for its upcoming solid-state drives that promise to offer decent performance, reliability as well as affordability. Samsung’s first TLC …
Read More »Kingmax reveals 3.20GHz DDR4 modules, projects rapid adoption in 2015
Kingmax, a well-known supplier of premium memory modules, on Thursday introduced its first DDR4 memory solutions with up to 3.20GHz effective clock-rate and also said that the adoption of DDR4 will rise in 2015. The family of Kingmax's DDR4 memory modules includes (or will eventually include) 288-pin DDR4 unbuffered DIMMs, …
Read More »Apple to consume 25% of the world’s mobile DRAM output in 2015
Although Apple is not the world’s largest supplier of personal computers, smartphones or tablets, it sells so many products that by 2015 it will consume 25 per cent of LPDDR memory produced in the world, according to analysts from TrendForce. At present Apple uses LPDDR3 memory inside its iPhones, iPads and MacBook …
Read More »Samsung mass produces 6Gb LPDDR3 chips using 20nm process technology
Samsung Electronics this week said that is has begun to mass produce 6Gb LPDDR3 memory devices using 20nm process technology. The new mobile DRAM ICs will be used to create 3GB LPDDR3 packages for high-performance smartphones and tablets. The thin process technology will make the new LPDDR3 solutions more energy-efficient …
Read More »G.Skill adds 3333MHz DDR4 memory modules into lineup
G.Skill this week added two new DDR4 options into the lineup of its memory modules. The new quad-channel memory kits for Intel Corp.’s latesthigh-end desktop “Haswell-E” platforms run at industry-leading frequencies of 3300MHz/3333MHz. The new “extreme high-end” Ripjaws 4-series DDR4 memory modules come in 16GB quad-channel kits. G.Skill's latest DDR4 memory …
Read More »G.Skill’s Ripjaws DDR4 memory modules overclocked to 4GHz
G.Skill said on Friday that its specialists have managed to overclock the company's Ripjaws 4-series DDR4 memory modules to rather whopping 4GHz effective data-rate. While 4004MHz this is not particularly the world’s record memory frequency, the achievement shows that the first-generation DDR4 memory modules are rather good for overclocking. To push …
Read More »Samsung begins to produce 64GB DDR4 modules based on TSV chips
Samsung Electronics on Tuesday said that has started to produce 64GB DDR4 memory modules that are powered by DDR4 memory chips that feature three dimensional (3D) “through silicon via” (TSV) package technology. The DRAM [dynamic random access memory] modules are designed for enterprise servers. Samsung’s 64GB registered dual inline memory …
Read More »JEDEC finalizes LPDDR4 standard, promises up to 4266MT/s data-rates
JEDEC, an organization that defines standards for computer memory, on Monday announced that it had finalized the LPDDR4, a next-generation standard for mobile DRAM [dynamic random access memory]. The new technology will enable data rates of up to 4266MT/s and will significantly boost performance of mobile devices, such as smartphones …
Read More »Samsung set to make LPDDR for Apple iPhone 6 – report
Apple and Samsung are direct rivals on the markets of smartphones and tablets, but when it comes to manufacturing of components, they have been partners for well over a decade. Although in the recent years Apple tried to reduce its orders to Samsung, it looks like it needs a steady …
Read More »G.Skill officially unveils 3.20GHz Ripjaws 4 DDR4 memory modules
G.Skill on Friday officially introduced its Ripjaws 4 DDR4 memory modules designed for performance enthusiasts. The Ripjaws 4 product line will include multiple modules with clock-rates ranging from 2133MHz to 3200MHz. G.Skill’s Ripjaws 4 quad-channel DDR4 memory kits will consist of 4GB or 8GB memory modules that work at 2133MHz, …
Read More »G.Skill’s Ripjaws 4 DDR4 memory modules pictured, detailed
Overclockers UK on Wednesday said that it will sell DDR4 memory modules from G.Skill in the U.K. and also revealed the first images of the Ripjaws 4 memory sticks as well as their specifications. G.Skill Ripjaws 4 DDR4 288-pin memory modules will operate at clock-rates up to 3.0GHz and will …
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