Home / Component / CPU (page 7)

CPU

Some Intel Arrow Lake-S CPUs may not be based on Intel 20A

Intel has already shared some details about the upcoming Arrow Lake-S platform. We know this hybrid architecture will use a new desktop socket (LGA1851), which should be based on the forthcoming Intel 20A process node. However, recent reports suggest that while some will be, others will use a different node. …

Read More »

AMD Zen 5 and Zen 5c CPUs to be built on TSMC N3 node

A recent report suggests that AMD's Zen 5 CPUs are set to reach TSMC fabs in the second quarter of this year, with mass production anticipated to begin in the third quarter of 2024. AMD and TSMC are gearing up their production facilities for the next-generation Zen 5 CPUs, based …

Read More »

Intel Core i9-14900KS to run at up to 6.2GHz

Recently, OCCT, Intel's benchmarking and stability tool, leaked details about the company's upcoming desktop KS CPU. According to a tester who put the chip through its paces, the 14900KS model features 24 cores, of which eight are P-Cores and 16 are E-Cores. With a default TDP of 150W, this CPU …

Read More »

Intel CEO says Panther Lake will double AI performance

During Intel's Q4 2023 earnings call, CEO, Pat Gelsinger, revealed that the upcoming Arrow Lake and Lunar Lake products are expected to provide an impressive threefold boost in AI acceleration compared to Meteor Lake, the first AI-enabled product in Intel's “Core Ultra” range. However, Intel plans to go even further …

Read More »

Intel Core i9-14900KS appears in the wild

Rumours have been circulating for months about a possible Intel Core i9-14900KS CPU, but up to now, there have been no real leaks about it. Although it's unclear if it's legit and not photoshopped, a picture of what seems to be a sample of the rumoured i9-14900KS has just appeared …

Read More »

Intel to keep Moore’s Law alive with 3D stacked CMOS transistors with backside power

As technology advances, the demand for faster computation is increasing, leading chip designers to seek ways to integrate more components into processors. At IEDM 2023, during a technical session, Intel researchers demonstrated their latest technological breakthrough that will allow just that: 3D-stacked CMOS transistors with backside power and direct backside …

Read More »