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Intel EMIB silicon helps chips talk to each other

Many of today’s devices including smartphones, computers and servers contain multiple smaller chips sealed inside a larger, usually rectangular package, communicating with each other via a complex multi-layered piece of silicon no bigger than a grain of rice. In the case of Intel powered devices, this communication between chips including …

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Intel addresses 14nm CPU supply struggles

Over the last few months, there has been plenty of talk surrounding Intel's CPU shipment troubles, with 14nm processors hitting a supply issue. As part of an update to customers today, Intel has acknowledged the issue and is promising to improve supply-demand balance. In a letter published this week, Intel …

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Cray and Fujitsu partner to power Exascale Era supercomputer

The supercomputer division of Hewlett Packard, Cray has partnered up with Japanese chip manufacturer Fujitsu to offer high-performance technologies for the Exascale Era. The new alliance will bring the first-ever commercial supercomputer combining a Fujitsu A64FZ ARM-based processor, high-bandwidth memory implemented by the Cray CS500 architecture and programming environment. Initial …

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New images of TRX40 motherboards appear

We are possibly only days away from the latest generation of high-end desktop processor wars between AMD and Intel. Until now, AMD has been rather quiet about information and specification of its new 3rd generation Ryzen Threadripper platform, although we expect some official details very soon. There has been a …

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Intel officially announces Tremont microarchitecture

Intel officially announced its new 10nm ULP x86 microarchitecture  – Tremont. This new microarchitecture will be at the core of Intel's Lakefield chipsets, planned to be used in servers, IoT devices, laptops, 5G networking, and tablets, like the Surface Neo. Yesterday, in Santa Clara, California, at the Linley Fall Processor …

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