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Anton Shilov

Apple and IBM to sell business-optimized iPad and iPhone devices

Although Apple’s iPad media tablet and iPhone smartphone are rapidly gaining popularity among business users, these mobile gadgets are still not true business-optimized solutions. On Tuesday Apple and IBM announced that they will jointly develop IBM MobileFirst platform for iOS that will bring IBM’s apps, big data and analytics capabilities …

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AMD preps two new GPUs made using 28nm HPM process technology

Although Advanced Micro Devices said earlier this year that it would use 20nm process technology from Taiwan Semiconductor Manufacturing Co. for its future chips, it looks like the company readies two new graphics processing units (GPUs) that will be made using TSMC’s 28nm HPM [high-performance mobile] process technology. Synapse Design, …

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Amazon may be developing its own smart eyewear

Amazon this week hired Babak Parviz, a former Google executive who led the development of the company's Glass wearable gadget. Several weeks ago Mr. Parviz was replaced from his position at Google, but remained at the company. Apparently, Amazon has offered the executive better opportunities than his former employee. Potentially, …

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Intel reports strong results as sales of PCs improve

Intel Corp. on Tuesday disclosed its financial results for the second quarter of the year. The company reported revenue of $13.8 billion, net income of $2.8 billion and gross margin of 64.5 per cent. As expected, Intel’s results improved because of better sales of personal computers and continued strong sales …

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Details of Intel Skylake client platforms leak online

A web-site has published the first details regarding Intel 100-series chipsets that will power personal computers based on the code-named Skylake microprocessors. As expected, Intel’s next-generation core-logic sets will support SATA Express as well as some other innovations. What is interesting is that the new chipsets will also support enhanced …

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Micron debuts world’s first 8Gb DDR3 memory chip

Micron Technology on Monday introduced the industry’s first monolithic 8Gb DDR3 memory component. Previously 8Gb memory chips were made by stacking together several 2Gb or 4Gb devices. 8Gb monolithic components will enable cost-effective, high-capacity solutions for servers. “The ability to scale with our customers' accelerating memory demand was a key …

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AMD’s Carrizo APUs rumoured to feature integrated HBM memory

One of the advantages that some of Intel Corp.’s integrated graphics processors (IGPs) have compared to AMD’s IGPs is a large level four cache that is used to store frequently used data. While at present AMD’s integrate graphics adapters are still faster compared to Intel’s, in the future the latter …

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Intel to demonstrate 14nm chips, 10nm wafers in September

In a bid to convince its partners and investors that it is on-track with its Tick-Tock strategy, Intel Corp. reportedly plans to showcase several yet-unannounced products at the Intel Developer Forum event this September. While the company will demonstrate certain new things, it does not mean that everything goes truly …

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WD’s HGST debuts world’s first 1.8TB 10K HDD

HGST, a subsidiary of Western Digital Corp., this week introduced the industry’s first hard disk drive with 1.8TB capacity, 10K rpm spindle speed and SAS-12Gb/s interface. The drive will be used in mission-critical applications that do not require maximum possible performance offered by solid-state storage solutions, but take advantage of …

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TSMC to speed up development of 10nm process technology

In a bid to retain its leadership position on the market of contract semiconductor manufacturing, Taiwan Semiconductor Manufacturing Co. is reportedly accelerating development of its 10nm FinFET process technology. At present TSMC is the leading contract maker of chips produced using 28nm process technology. It is believed that the company makes considerably …

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Intel delays higher-end ‘Broadwell’ chips to July – September, 2015

Intel Corp. has reconsidered the launch schedule of its next-generation microprocessors code-named “Broadwell” and further delayed not only mainstream mobile parts, but also the high-end desktop and notebook models. Based on the new plan, the company may introduce the new Core i-series microprocessors only in July, or even September, 2015. …

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Intel ‘Broadwell’ chips will be available for two weeks in 2014

Brian Krzanich, chief executive officer of Intel Corp., once said that the company’s upcoming microprocessors code-named Broadwell would be available by the holiday season and “not at the last second of holiday.” According to a revised launch schedule of Intel’s 14nm chips, the Broadwell family of central processing units will …

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Nvidia may skip 20nm process technology, jump straight to 16nm

The exact plans of Advanced Micro Devices and Nvidia Corp. concerning the 20nm process technology from Taiwan Semiconductor Manufacturing Co. have never been publicly revealed and are not completely clear at this point. One of the reasons for that are low manufacturing yields, which forces fabless semiconductor designers to reconsider …

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Samsung to make TLC 3D V-NAND flash memory

Samsung Electronics plans to wed triple-level cell NAND flash technology with vertical stacking of NAND flash memory. The new type of NAND will be very cost-efficient to manufacture, which will help Samsung to decrease pricing of its solid-state storage solutions, such as memory cards, storage modules, solid-state drives and so …

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